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Friday 16 August 2024
TSMC to see CoWoS production capacity reach 60,000 wafers in 2025
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Thursday 15 August 2024
How ESMC project is cementing Taiwan's role in global chipmaking
Following the United States and Japan, TSMC's final overseas wafer fab, ESMC (European Semiconductor Manufacturing Company), will...