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Tuesday 14 April 2026
AUO drives energy business corporatization to boost integration efficiency
AUO has announced that its Board of Directors has approved a restructuring plan for its energy business's organization and investment framework, aiming to consolidate internal and...
Monday 13 April 2026
BYD expands driver tech, but software gaps come into focus

The choice of sensing architecture and the efficiency of data iteration have emerged as decisive factors in the competitiveness of advanced...

Sunday 12 April 2026
Ennostar shifts to profit focus, ramps Micro LED and optical communications

Ennostar Inc. chairman Paul Peng said the company has emerged from a multi-year restructuring phase and is now entering a period of acceleration,...

Saturday 11 April 2026
Samsung Exynos 2700 benchmark leak offers early look at 2nm SF2P performance
Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process...
Saturday 11 April 2026
Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy
Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push...
Friday 10 April 2026
AI spending shifts to edge inference as GITEX Asia spotlights monetization push

GITEX Asia 2026 wrapped up in Singapore with a clear shift in industry priorities, as artificial intelligence (AI) spending moves from...

Friday 10 April 2026
Intel–Google alliance reframes AI infrastructure around CPUs
A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...
Friday 10 April 2026
STMicroelectronics expands 800 VDC AI datacenter power portfolio with NVIDIA

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the expansion of its...

Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible...
Thursday 9 April 2026
GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints...

Thursday 9 April 2026
Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced...
Thursday 9 April 2026
MetaOptics claims three-year lead in advanced micro-optics
MetaOptics' emphasis on 150nm direct-write semiconductor techniques could reshape global supply chains for advanced micro-optics, promising higher optical efficiency and a manufacturing...
Wednesday 8 April 2026
Uber deploys AWS custom chips to scale AI and cut compute costs

US ride-hailing platform Uber has announced a partnership with Amazon Web Services (AWS) to deploy its in-house custom chips, aiming to...

Wednesday 8 April 2026
SK Hynix begins supply of 321-layer QLC cSSD for the AI PC era
SK Hynix has started global shipments of a next-generation compact SSD designed for AI-driven personal computers, a move that could reshape storage choices for device makers and end...
Tuesday 7 April 2026
Tescan Showcase Integrated Failure Analysis Solutions at SEMICON China 2026

Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure...