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NEWS TAGGED EDA
Thursday 23 November 2023
Chinese EDA company GWX Technology sees 28nm as a breakthrough point
The new 7nm chip of the Huawei Mate 60 Pro has sparked widespread discussion, but from the perspective of promoting localization in the Chinese semiconductor industry, more industry...
Monday 6 November 2023
Chinese EDA software developers scale up R&D to expand market share
As part of the indigenization efforts to decouple itself from US semiconductor technologies, China-based EDA tool providers saw their RD expenditure growing amid lucrative government...
Friday 3 November 2023
Government accepts donation of 12-inch wafer fab equipment to bolster Taiwan's chip-driven innovation
In a significant development for the 10-year Taiwan Chip-Driven Industrial Innovation Program (TCIIP), certain businesses have expressed their willingness to donate 12-inch wafer...
Wednesday 18 October 2023
EDA and auto chips identified as China IC industry's biggest chance amid US sanctions
ICWise, a semiconductor consultancy firm based in Shanghai, hosted an IC Industry Leader Summit in Shanghai recently. Many senior executives of local semiconductor companies participated...
Friday 13 October 2023
Software is now the winning formula for chip design firms
During the FUTEX Forum held on October 12 in Taipei, Realtek Vice President and Spokesperson Huang Yee-Wei noted that most challenges in IC designs are not so different from the ones...
Wednesday 11 October 2023
Weekly news roundup: How did Huawei design its Kirin 9000S chip without American EDA tools and other top stories
These are the most-read articles during the week of October 2-6, 2023:
Friday 6 October 2023
How did Huawei design its Kirin 9000S chip without American EDA tools?
Huawei's success in having its self-developed SoC produced with 7nm technology by SMIC, China's largest wafer foundry service provider, stunned the world. Since Huawei is unable to...
Thursday 5 October 2023
EDA companies gearing up for 4nm RFIC designs
Electronic design automation (EDA) companies have sped up their development of 4nm radio-frequency IC (RFIC) designs.
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Monday 18 September 2023
Can generative AI shorten China's IC design learning curve? Q&A with UC Berkeley Prof. Alberto Sangiovanni-Vincentelli (Part 1)
Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...
Tuesday 15 August 2023
Intel, Synopsys expand partnership
Intel and Synopsys have reached an agreement to expand their IP and electronic design automation (EDA) strategic partnership by developing a portfolio of IP on Intel 3 and Intel 18A...
Friday 21 July 2023
Interview with Synopsys CEO Aart de Geus: AI tools will accelerate realization of SysMoore law
The emergence of ChatGPT in late 2022 and early 2023 has promoted a new wave of AI trends. The semiconductor sector has received some of the most attention amidst this trend. This...
Tuesday 27 June 2023
Chinese EDA players push for mixed-signal chip design simulation breakthrough
China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation...
Friday 2 June 2023
Keysight joins TSMC OIP 3D Fabric Alliance
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Wednesday 24 May 2023
Vietnam could be the next IC design hub
Boasting favorable government policies, lower overall labor costs, burgeoning local semiconductor actors such as Viettel, Vingroup, and FPT, Vietnam is garnering more than mere attention...
Dec 8, 10:41
ASUS Handheld Ultrasound LU700 series: lightweight, high resolution and long battery life solution for mobile healthcare
Friday 8 December 2023
Clientron garners the prestigious 2024 Taiwan Excellence Award for innovative Smart eCockpit of Electric Vehicle
Wednesday 6 December 2023
AIRA features CPU-powered face recognition to address market challenges
Tuesday 5 December 2023
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Approximately 1,400 ASML equipment installed in China, limited application for advanced chip expected
Huawei's 5nm chip in L540 NB could be inventory made by TSMC before US ban
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung and SK Hynix will both supply HBM3 for AWS Trainium 2
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
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