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NEWS TAGGED EDA
Thursday 1 October 2026
Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development
Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
Thursday 1 October 2026
Synopsys and OpenAI to share revenue from AI model built to run chip design tools
Synopsys is betting that the surest way to keep generative AI from eroding its electronic design automation (EDA) franchise is to build the model together with the AI developer and...
Thursday 24 September 2026
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Monday 14 September 2026
India's chip show nearly doubles in two years, with suppliers leading the build-out
The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
Friday 11 September 2026
Taiwan govt boosts EDA R&D to target global gaps
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
Friday 4 September 2026
How agentic AI and 'AI physics' are reshaping chip design
As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...
Thursday 3 September 2026
UniVista expands China EDA stack with AI agents, native 3DIC tools
Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...
Monday 31 August 2026
Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Thursday 27 August 2026
Synopsys lifts 3QFY26 sales, raises full-year outlook
Synopsys, a leading electronic design automation (EDA) company, reported stronger-than-expected fiscal third-quarter results for the 2026 fiscal year (3QFY26) as the AI boom drove...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
Thursday 13 August 2026
Siemens EDA unveils AI-Native Design strategy in South Korea
Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...
Thursday 23 July 2026
Moonshot AI model challenges EDA moat with 2-day chip design
China AI startup Moonshot AI has drawn intense attention from the semiconductor industry after unveiling its new large language model Kimi K3, which delivered strong results across...
Wednesday 22 July 2026
Siemens to acquire Precision Innovations for AI-powered chip planning
Siemens said it has agreed to buy Precision Innovations in a deal that would add AI-powered chip planning tools to its electronic design automation business. The move could affect...
Thursday 16 July 2026
Cadence launches agentic AI platform for PCB and package design
Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...