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Thursday 24 July 2025
Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

Thursday 24 July 2025
Huawei's shadow fab (1): the secret chip agenda at the heart of Shenzhen
As US–China tech tensions escalate, semiconductors have become the focal point in a broader race for technological sovereignty. Three obscure yet strategically vital wafer foundries,...
Thursday 24 July 2025
1H25 EMS top 20 analysis: DIGITIMES dissects 3 power shifts behind AI-era shake-up

The first half of 2025 has reshaped the global EMS/ODM landscape, with generative AI emerging as the new industry driver. In a ranking...

Thursday 24 July 2025
Car industry questions Huawei's no car-making pledge as HIMA surges
Huawei's Harmony Intelligent Mobility Alliance (HIMA) reached top five in total sales in June, just one spot behind Tesla China, an indication of the beginning of Huawei's path to...
Thursday 24 July 2025
Seoul National University launches projects to address AI talent crunch
Amid South Korea's severe talent shortage in high-end engineering and technology during the AI era, the College of Engineering at Seoul National University (SNU) has proposed a dual-track...
Thursday 24 July 2025
Samsung unveils 9nm DRAM strategy
Samsung Electronics is reportedly planning to introduce a vertical 4F Square structure for its in-development 9nm DRAM products, while continuing development of the existing 6F Square...
Thursday 24 July 2025
China-Taiwan trade heating up amid US tariffs saga
Business exchanges between Chinese and Taiwanese makers have shown significant increases amid concerns over US tariffs, trade restrictions, and global supply chain restructuring,...
Thursday 24 July 2025
SK Hynix reassures on China fabs with stable VEU status amid US AI chip export easing
SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...
Thursday 24 July 2025
New trade deal likely to have minor effect on Japanese auto market, say analysts
With Japan agreeing to invest US$550 billion in US markets and open sectors including automobiles, rice, and agricultural products under a new trade agreement in exchange for the...
Thursday 24 July 2025
SK Hynix optimistic on HBM demand amid AI growth, highlights next-gen DRAMs
In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...
Thursday 24 July 2025
'Awkward' fit: Nvidia's H20 snubbed in China as Qihoo 360 turns to Huawei AI chips
Nvidia's H20 chip has re-entered the Chinese market but is facing an underwhelming reception, as influential tech leaders increasingly favor local semiconductor alternatives. Zhou...
Thursday 24 July 2025
Samsung plans HBM4 comeback with advanced chip technology
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
Thursday 24 July 2025
China gains ground on Taiwan's OSAT dominance amid pricing revolt
Taiwan continues to dominate the global outsourced semiconductor assembly and test (OSAT) market, but China is catching up quickly. Driven by state-backed chip self-reliance efforts,...
Thursday 24 July 2025
AWS shutters Shanghai AI lab, following Microsoft and IBM exits
AWS has confirmed that its last overseas research institute, located in Shanghai, has officially disbanded, stating that this organizational adjustment aligns with the company's future...
Wednesday 23 July 2025
SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...