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    LG Electronics's three strategies to counter competition from Chinese brands
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    China's SeeYA wins Meta’s MR panel order as BOE misses certification
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    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
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    InP enters a capacity race as TCL moves into indium phosphide laser chips
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    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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    NEWS TAGGED DIGITIMES ASIA
    Monday 22 December 2025
    Weekly news roundup: Intel's TSMC talent grab draws scrutiny, Samsung foundry lands Intel order, Moore's Law talent gap looms
    These are the most-read DIGITIMES Asia stories in the week of December 15 to December 21, 2025.
    Monday 15 December 2025
    Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
    These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
    Monday 8 December 2025
    Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
    According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
    Monday 8 December 2025
    Weekly news roundup:Intel hires TSMC veteran, Samsung reportedly wins TPU HBM4 order
    These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
    Monday 1 December 2025
    Weekly news roundup: China phone makers pull back as Huawei advances chip tech, Nvidia strengthens Taiwan ties
    These are the most-read DIGITIMES Asia stories in the week of November 24 to November 30, 2025.
    Monday 24 November 2025
    Weekly News Roundup: US moves to ban Chinese chipmaking equipment; Tesla eyes in-house fab; Intel hires TSMC veteran
    These are the most-read DIGITIMES Asia stories in the week of November 17 to November 23, 2025.
    Friday 21 November 2025
    Marvell plans to expand India workforce amid AI-driven growth
    US semiconductor company Marvell Technology has announced plans to significantly increase its workforce and research spending in India, aiming to meet the surging global demand for...
    Monday 17 November 2025
    Weekly news roundup: Musk advances US chip-fab plans; SpaceX shifts industry economics; memory shortages continue into 2026
    These are the most-read DIGITIMES Asia stories in the week of November 10 to November 16, 2025.
    Monday 10 November 2025
    Weekly news roundup: LGES probes tech Theft; ASML pivots in China; Samsung sparks market chaos; Nexperia feud explodes
    Below are the top DIGITIMES Asia stories from November 3 to November 10, 2025.
    Monday 3 November 2025
    Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam
    Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.
    Monday 27 October 2025
    Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
    Below are the top DIGITIMES Asia stories from October 20 to 26, 2025.
    Monday 20 October 2025
    Weekly news roundup: Nvidia rises as TSMC's top customer; Netherlands seizes Nexperia; Google considers MediaTek for next Pixel
    Below are the top DIGITIMES Asia stories from October 13 to 19, 2025.
    Monday 13 October 2025
    Weekly news roundup: China pushes DUV breakthroughs, Intel and AMD weigh partnership, Arm CEO reflects on Nvidia's strategic pivot
    Below are the top DIGITIMES Asia stories from October 6 to 12, 2025.
    Tuesday 7 October 2025
    Weekly news roundup: Intel and TSMC pour billions into Arizona; Memory chip prices soar, Hanmi expands to Singapore to support Micron
    Below are the most-read DIGITIMES Asia stories from the week of September 29–October 5.
    Monday 22 September 2025
    Weekly news roundup: Micron halts NAND and DRAM quotes; Nvidia shifts quantum strategy, memory prices soar on AI demand
    Below are the most-read DIGITIMES Asia stories from the week of September 15–September 21.
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    GlobalExhibition
    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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