News tagged development at DIGITIMES

NEWS TAGGED DEVELOPMENT

Thursday 1 October 2026

From Excel to Editable Presentations: AI Streamlines Financial Reporting

Financial institutions routinely process massive volumes of operational data, turning complex analysis into executive presentations for trend tracking, performance evaluations,...

Wednesday 30 September 2026

Taiwan backs TSMC's US push but insists core R&D stays home

Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...

Wednesday 30 September 2026

ASE Technology buys Singapore factory for AI chip testing expansion

ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...

Wednesday 30 September 2026

SK Hynix resumes DDR4, DDR5 packaging orders with Winpac

SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...

Wednesday 30 September 2026

Jensen Huang rejects AI doomsday framing, calls safety an engineering problem

As warnings about catastrophic AI risks intensify, Nvidia CEO Jensen Huang is making a different case: AI safety should be treated as an engineering challenge, not a justification...

Wednesday 30 September 2026

India bars Semicon 2.0 chip plants from selling or mortgaging assets before full production

India has barred semiconductor projects approved under its Semicon 2.0 program from selling, disposing of, or mortgaging project assets until commercial production of the entire project...

Wednesday 30 September 2026

Florida seeks order to block OpenAI AI model launches

Florida Attorney General James Uthmeier on September 28 asked a court for a temporary injunction to prevent OpenAI from developing new models without third-party-approved safety safeguards...

Wednesday 30 September 2026

AIDC conducts counter-drone system drill to expand airspace protection for critical infrastructure

Taiwanese aerospace company Aerospace Industrial Development Corporation (AIDC) said that after completing production of its advanced jet trainers, it will focus on accelerating the...

Tuesday 29 September 2026

Mercedes-Benz and ProLogium expand solid-state battery testing partnership

ProLogium Technology said it has signed a joint testing agreement with Mercedes-Benz, giving the automaker priority access to evaluate the battery maker's latest Gen4 cells. The companies...

Tuesday 29 September 2026

SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization

Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...

Tuesday 29 September 2026

Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5

Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...

Tuesday 29 September 2026

AIDC sees NT$30 billion military maintenance boost, eyes drones

As the last Brave Eagle advanced trainer rolls off the line in September 2026, Aerospace Industrial Development Corporation (AIDC) says its military business is not ending with the...

Tuesday 29 September 2026

Taiwan breaks ground on aerospace and drone hub, targeting 2028 completion

Taiwan's National Chung-Shan Institute of Science and Technology (NCSIST) broke ground on the Minxiong Aerospace and Drone Industrial Park on September 28, aiming to provide critical...

Tuesday 29 September 2026

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

Tuesday 29 September 2026

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...

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