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Tuesday 5 March 2024
GenAI drives HBM memory demand
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Monday 4 March 2024
Apple's AI pivot: the challenges and the quest for new alliances
Apple's bold move to scrap its decade-long car project in favor of a full-fledged pivot to AI development highlights the industry's evolving landscape. While Apple boasts numerous...
Friday 1 March 2024
AI integration: a game-changer for Open RAN development at MWC 2024
At MWC 2024, the spotlight shines brightly on AI as the driving force behind innovation in the...
Friday 1 March 2024
Something tricky this way comes as China's EV empire grows
The aggressive market capture tactics, employed by Chinese car manufacturers, present fresh challenges for the global electric vehicle (EV) industry.
Friday 1 March 2024
MWC 2024: integration of terrestrial and non-terrestrial networks key to 6G development
The development of next-generation communication technologies occurs approximately every 10 years. The international communication standards organization 3GPP has gradually initiated...
Friday 1 March 2024
TSMC co-COOs could be a stepping stone to new leadership, say sources
With TSMC's announcement in December 2023 that chairman Mark Liu will step down after the shareholder meeting in June 2024, the pure-play foundry has begun a new round of organizational...
Thursday 29 February 2024
TSMC appoints two executives as Co-COOs, passing the baton on
Taiwan Semiconductor Manufacturing Company (TSMC) Board of Directors held a special meeting on February 29 and approved the appointment of Senior Vice President of R&D Y.J. Mii...
Thursday 29 February 2024
SK Hynix said to purchase 8 EUV machines for HBM3E processes
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...
Thursday 29 February 2024
'I'll see your 8-layer HBM3E and raise you 36GB 12-layer HBM3E' Samsung tells Micron
Samsung is engaged in fierce HBM competition with Micron.
Tuesday 27 February 2024
2024 Industry Outlook (1): cross-discipline competitions and diversified business development
Newcomers to the industry are often intimidated by the flexibility and diversity of the strategies of the traditional large companies that are constantly responding to change. When...
Friday 23 February 2024
Taiwan unveils draft plan for expanding semiconductor clusters in Hsinchu Science Park
The National Development Council (NDC) has just revealed a draft implementation package for the "Taoyuan-Hsinchu-Miaoli Silicon Valley Promotion Plan," proposed by President-elect...
Friday 23 February 2024
Creating new EV charging vision: Q&A with Chander Electronics general manager Robert Lo
As one-sixth of new car buyers worldwide purchased EVs in 2023, the vehicle has gradually become part of people's daily lives. In September last year, Taiwan-based Chander Electronics...
Thursday 22 February 2024
SKT, MediaTek, Nota AI's data transmission breakthrough promises phone battery for days
South Korean SK Telecom (SKT), MediaTek, and Nota AI want to keep your phone charged for longer.
Wednesday 21 February 2024
Exclusive: Kaynes SemiCon partners with one more Taiwanese company to boost India's semiconductor ecosystem
Kaynes SemiCon, a subsidiary of the Indian EMS Kaynes Technology, has entered into a strategic partnership with Recynergy Technology, a Taiwan-based company specializing in semiconductor...
Wednesday 21 February 2024
Tech giants reshuffle amid AI surge: insights from former Microsoft Research Asia VP
The tech industry's resurgence and restructuring driven by the AI wave have led to a reshuffling of market value rankings among major players like Microsoft, Apple, Nvidia, and Google,...