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NEWS TAGGED CSP
Monday 22 May 2017
Epistar expects increases in CSP LED chip shipments for TV BLUs in 3Q17
LED epiwafer and chip maker Epistar expects shipments of CSP (chip-scale packaging) LED chips for LCD TV backlighting to increase beginning third-quarter 2017, according to the com...
Wednesday 29 March 2017
Xintec looks to turnaround in 2H17
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Tuesday 28 March 2017
Greatek building high-end packaging capacity
Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...
Monday 26 December 2016
Genesis Photonics boosting FC CSP application to avoid continued net losses
Genesis Photonics has been making efforts to promote FC CSP (flip chip chip scale packaging) for automotive headlights in a bid to bounce back from eight consecutive quarters of net...
Monday 3 October 2016
Epistar to quadruple CSP LED capacity
LED epitaxial wafer and chip maker Epistar, in view of fast growing demand for CSP (chip scale package) LED chips used in TV backlighting, will expand production capacity to four...
Thursday 21 January 2016
Digitimes Research: CSP LED devices a foucs at Lighting Japan 2016
At the Lighting Japan 2016 exhibition in Tokyo during January 13-15, CSP (chip scale package) LEDs were a major focus. There were CSP LEDs developed by Japan-based GeneLite for smartphone...
Monday 4 January 2016
Genesis Photonics starts shipments of CSP
LED epitaxial wafer and chip maker Genesis Photonics has begun to ship CSP of (chip scale package) of chips for use in automotive headlights, backlighting of LCD TVs and camera flashes,...
Thursday 21 May 2015
Xintec profits soar in 1Q15
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Tuesday 7 April 2015
Altera, TSMC develop UBM-free WLCSP packaging
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
Tuesday 17 March 2015
Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Tuesday 6 January 2015
IC substrate makers gearing up for expansion
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package...
Wednesday 3 September 2014
Niching looks to ramp up LED leadframe and FC CSP substrate shipments in 2015
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
Tuesday 20 May 2014
SPIL setting up FC CSP capacity in eastern China
Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...
Monday 30 December 2013
IC substrate makers to ramp up FC CSP substrates in 2014
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
Tuesday 18 June 2013
NPC 2013 capex to focus on FC CSP substrates, says president
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...