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Grand Opening of Wolfspeed Mohawk Valley 200mm SiC Fab
Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED CSP
Monday 22 April 2013
The possibility of using PIC in CSP process
Can photoimageable coverlay (PIC) be adopted for chip scale package (CSP) process, replacing the commonly used dry film to solve the problem of a multilayer chip's insulation layer...
Monday 7 January 2013
Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
Thursday 4 October 2012
FC CSP substrate supply may be affected by explosion at Nippon Shokubai
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Thursday 20 September 2012
Kinsus looks to increasing shipments of FC CSP substrates in 4Q12
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Tuesday 4 October 2011
Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Friday 9 September 2011
Unimicron lands orders from TI and Apple, says paper
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
Tuesday 17 May 2011
Kinsus lands FC CSP substrate orders from Intel, says paper
IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...
Tuesday 28 September 2010
Kinsus to commence operation of China plant
Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...
Wednesday 28 July 2010
Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10
IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...
Monday 26 October 2009
NPC expects strong revenues from FC CSP substrates in 2010
Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...
Tuesday 18 August 2009
Kinsus FC CSP substrate utilization rate up on orders from Qualcomm
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...
Wednesday 17 June 2009
IC substrate maker Kinsus says high-margin products to sustain growth for 2H09
Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...
Friday 20 March 2009
Kinsus expects strong substrate shipment growth in March due to China 3G deployment
IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...
Friday 20 February 2009
Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009
Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month. The company expects sales to increase to NT$500-550 million in February...
Monday 19 January 2009
IC substrate maker Kinsus to see sales decline but will remain profitable in January
Investors estimate Kinsus Interconnect Technology's January sales to be only around NT$500 million (US$14.93 million) due to sagging market demand. However, the company said it expects...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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