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    China's OLED capacity expansion threatens South Korea's auto and IT panel lead
    8h 22min ago
    China plans 6x AI computing expansion in five years, eyes 100,000-card clusters
    8h 22min ago
    Exclusive: European automakers reportedly expand China software teams despite layoffs
    8h 22min ago
    Chinese automakers face a crucial test in global localization
    8h 22min ago
    Analysis: Huawei and Xiaomi push China’s chipmaking race into a new phase
    8h 22min ago
    Mature-node chip shortages may last until 2028, turning supply chain management into a pricing lever
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    NEWS TAGGED CMP
    Sunday 6 September 2026
    BenQ Materials targets CPO in semiconductor push
    BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
    Thursday 27 August 2026
    HBM hybrid bonding delayed by 300°C heat and CMP dishing
    As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...
    Monday 24 August 2026
    Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
    Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Monday 13 July 2026
    India opens first CMP pad technology hub in Hyderabad
    India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
    Sunday 5 July 2026
    Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
    Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
    Wednesday 24 June 2026
    China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
    Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
    Monday 4 May 2026
    BenQ Materials unit Cenefom enters memory supply chain with CMP brush wheels
    BenQ Materials is accelerating its expansion into semiconductor materials as its subsidiary Cenefom officially begins operations at its new Guangyuan plant. The facility's chemical...
    Thursday 16 April 2026
    JSR restarts Taiwan production as TSMC dominates advanced nodes
    Japanese photoresist leader JSR officially announced on April 15 the establishment of an advanced planarization process solutions research center in Hukou, Hsinchu, Taiwan.
    Sunday 12 April 2026
    China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

    Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment,...

    Saturday 11 April 2026
    BenQ Materials expands into semiconductor processes, targets advanced nodes

    BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers...

    Friday 10 April 2026
    Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
    As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
    Wednesday 1 April 2026
    AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
    Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
    Monday 22 December 2025
    China’s AMEC broadens chip equipment reach with Sizone acquisition

    AMEC, China's leading semiconductor equipment vendor, has sent its clearest signal yet that it no longer intends to remain a single-discipline...

    Friday 21 November 2025
    Fujifilm to build semiconductor materials factory in India, targeting regional exports
    Fujifilm President Teiichi Goto announced on November 14, 2025, in Tokyo that the company plans to establish a semiconductor materials manufacturing facility in India. The factory...
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    BIZ FOCUS
    Sep 8, 08:00
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Keywave Technology innovative radar sensors spark a smart sensing revolution
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