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Encore! SK Hynix boasts reusable CMP breakthrough

Jessica Tsai; Samuel Howarth, DIGITIMES Asia 0

Credit: SK Hynix

SK Hynix has successfully developed a "grinding pad reuse technology" for Chemical Mechanical Planarization (CMP) processes. It is expected to be introduced to the production line in 2024. The tech has the potential to reduce manufacturing costs and...

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