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    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 3 June 2025
    Flexium Interconnect pushes forward in AI server while rejoining Apple suply chain amid transformation challenges
    Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While...
    Tuesday 3 June 2025
    Tata Electronics reportedly eyes Malaysia for semiconductor acquisition to bolster ATMP capabilities

    Tata Electronics is reportedly in advanced talks to acquire a semiconductor facility in Malaysia,...

    Tuesday 3 June 2025
    Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships
    Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...
    Tuesday 3 June 2025
    US targets EDA exports as Xiaomi’s XRing O1 raises alarm over China’s IC design gains
    Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...
    Tuesday 3 June 2025
    Zhen Ding sees tariff risk as minimal, but braces for forex losses

    Zhen Ding Technology, the world's leading printed circuit board (PCB) manufacturer, held its 2025 annual shareholders' meeting on May...

    Tuesday 3 June 2025
    South Korea's chip crown becomes a strategic burden

    South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With SK...

    Monday 2 June 2025
    Nanya targets 4Q25 profitability as DDR4 rivals exit
    Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements...
    Monday 2 June 2025
    Xiaomi's XRing O1 stirs 'self-developed' chip debate with Arm DNA and custom AI engines
    Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's...
    Monday 2 June 2025
    Trump holds reins on Wolfspeed's future as foreign buyers balk at 'Made in USA' cost burden
    Wolfspeed, the US leader in silicon carbide (SiC) materials and a key player in the power semiconductor supply chain, has denied recent bankruptcy rumors. However, delays in receiving...
    Monday 2 June 2025
    EDA cutoff lays bare China's design fragility in advanced semiconductors

    China's semiconductor sector is reeling from reports that Siemens EDA has been instructed by the US Bureau of Industry and Security (BIS)...

    Monday 2 June 2025
    Nvidia sees US$8B revenue shortfall as China sales crater, turns to Shanghai R&D for strategic hold
    Nvidia revealed on May 29 its fiscal 2026 second-quarter revenue forecast of US$45 billion, with a margin of error of plus or minus 2%.
    Monday 2 June 2025
    Samsung squeezed: TSMC scales 3nm heights, SMIC cracks 5nm
    Samsung Foundry has boosted utilization with fresh 7nm and 8nm chip orders from Nintendo and multiple AI chipmakers. Yet its persistent setbacks at the 3nm node continue to spotlight...
    Monday 2 June 2025
    Trump's foreign students crackdown fuels China tech talent homecoming
    In a sweeping crackdown on international students, US President Donald Trump has barred Harvard University from admitting foreign students—a policy likely to extend to other...
    Monday 2 June 2025
    Xiaomi's XRing O1 fast-tracks in-house SoC lessons Apple took 15 years to learn
    When Xiaomi founder and CEO Lei Jun set his sights on replicating Apple's vertical integration playbook, he may have overlooked how unceremoniously Apple's own chip journey began....
    Monday 2 June 2025
    AI infrastructure bottlenecks drive hardware startup interest
    As artificial intelligence (AI) systems strain existing computing infrastructure, a new generation of startups is emerging to address fundamental hardware limitations. At Computex...
    254/350 pages
    biz
    BIZ FOCUS
    Feb 4, 08:00
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Tuesday 3 February 2026
    Asia FinTech Alliance (AFA) Announces Leadership Election Results
    Monday 2 February 2026
    Smiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026
    Friday 30 January 2026
    BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook