As semiconductors evolve into critical assets for national security and sovereign AI ambitions intensify, TSMC has emerged as a strategic lynchpin in the global chip race. While the...
Just one day after announcing plans to deploy 3,000 Huawei Ascend-powered AI servers by 2026, Malaysia's Deputy Communications Minister Teo Nie Ching abruptly retracted the statement...
Zeiss made its debut at Computex 2025, unveiling industrial metrology tools designed for AI server manufacturing, including CT scanners, 3D scanning systems, and industrial microscopes...
Of the seven semiconductor fabs completed in Japan during fiscal 2023–2024 (April 2023 to March 2025), only three had begun mass production by April 2025. New facilities from...
China's Ministry of Commerce has denounced new US restrictions targeting Huawei's artificial intelligence (AI) chips, arguing the move threatens the recently established trade consensus...
TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment...
In a keynote on May 19, 2025, Nvidia CEO Jensen Huang focused on AI infrastructure, AI agents, and physical AI (robots). He highlighted that AI agents require significantly more computing...
South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
At this year's COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company's proprietary NVLink interconnect to third-party ASICs and CPUs...
Nvidia CEO Jensen Huang announced an expanded collaboration with Foxconn and the Taiwan government to develop an AI factory, a project that will utilize 10,000 Nvidia GB300 GPUs.
Following his keynote at Computex 2025, Qualcomm CEO Cristiano Amon announced that new updates for the Oryon CPU computing will be released in 2025. This includes the possible launch...
Xiaomi founder and CEO Jun Lei announced on May 19 via Weibo that the company will unveil its first 3nm mobile system-on-chip (SoC), the "Xring O1," on May 22. He also revealed that...
Years after launching the Pinecone Surge S1 in 2017, Xiaomi founder and CEO Lei Jun announced the company's return to in-house smartphone chip design. Its new self-developed SoC,...
