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Monday 23 December 2024
Innolux seeks assistance to advance FOPLP technology
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Monday 23 December 2024
Innolux expands semiconductor footprint with FOPLP and silicon photonics
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
Monday 23 December 2024
TSMC capacity expansion powers supply chain for 2025 boom
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
Monday 23 December 2024
3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
Monday 23 December 2024
China chip sector sees 14,000 closures in 2024 amid industry reshuffle
The Chinese chip market faces severe challenges during the semiconductor industry's down cycle, with 14,648 chip companies shutting down in 2024. However, the entrepreneurial spirit...
Monday 23 December 2024
Gree's 6-year chip success: SiC factory launches with 200 million units shipped, fully self-funded
On December 16, Gree Electric Chairwoman Ming-zhu Dong told Sina Finance CEO Qing-xu Deng, "Gree's chips have succeeded. We have achieved everything from independent research and...
Monday 23 December 2024
Nanya to invest NT$6.6bn in DRAM design firm PieceMakers for AI memory solutions
Nanya Technology has greenlit a strategic alliance with DRAM design firm PieceMakers Technology, committing up to NT$6.6 billion (US$1.5 million) in a cash capital increase to secure...
Monday 23 December 2024
Nvidia resolves GB200 challenges, gears up for AI dominance in 2025
Nvidia has overcome production hurdles for its highly anticipated Blackwell chip, with CEO Jensen Huang confirming the resolution of design flaws in collaboration with TSMC. Shipments...
Monday 23 December 2024
SK Hynix unveils 61TB SSD, challenging Samsung in AI data center market
Amid surging AI demand, SK Hynix has unveiled a 61TB SSD tailored for AI data centers, marking a significant leap in the enterprise SSD (eSSD) market and intensifying competition...
Monday 23 December 2024
Samsung reportedly to begin construction of 7th-gen DRAM pilot line
Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing...
Monday 23 December 2024
TSMC soars while Rapidus, SMIC stumble on state crutches
The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel...
Monday 23 December 2024
Micron advances HBM4 development, sets 2026 for mass production
Micron Technology announced during its latest investor conference that its HBM4 development is progressing as planned while revealing development of HBM4E is underway. The company...
Monday 23 December 2024
Marvell highlights India's semiconductor growth ahead of VLSI conference
India's semiconductor industry will convene next month in Bengaluru for the 38th VLSI Design Conference, a flagship event showcasing advancements in chip design, research, and inno...
Monday 23 December 2024
Samsung, Texas Instruments Finalize Chips Act Awards Deals
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in
the US, cementing...
Monday 23 December 2024
Weekly news roundup: Chinese chip crackdown intensifies as global semiconductor landscape shifts
Semiconductor Week in Review (Dec 15 - 21) :