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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 24 June 2026
Cerebras posts 92% revenue growth in first public quarter, but warns compute rentals will squeeze margins
Cerebras Systems delivered 92% revenue growth in its first quarter as a public company, but management cautioned that its decision to rent back computing capacity from an existing...
Wednesday 24 June 2026
China's chip-equipment push starts to weigh on Japanese suppliers

China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

Wednesday 24 June 2026
AI server VRM shifts drive power shortages and stretch lead times past 6 months
The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads...
Wednesday 24 June 2026
VFT targets semiconductors, foldable display, energy materials

Optical film and nano-coating materials developer Victory For Technology (VFT) is focusing on three key areas — AI and semiconductor...

Wednesday 24 June 2026
Samsung pushes memory supply deals as demand spreads beyond HBM

Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens...

Wednesday 24 June 2026
Europe's quantum patents hit record growth, but startup funding loses steam

At VivaTech 2026 in Paris last week, Philippe Keryer, Chief Strategy and Innovation Officer at Thales, identified Europe's core quantum...

Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
Wednesday 24 June 2026
Samsung's Texas fab gains momentum with the arrival of ASML engineers

Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
Nippon Sanso raises helium prices over 30% on Middle East instability-driven supply crunch

Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting...

Tuesday 23 June 2026
Fulltech sees low DK2 shipments rising, starts M9 quartz cloth certification
Fulltech, a glass fiber yarn and cloth maker, said at its 2026 annual general meeting that demand for next-generation AI servers and high-speed switches is lifting specifications and...
Tuesday 23 June 2026
Smartphone demand and chip supply pressures cloud 2H26 peak season outlook
Market sentiment toward the smartphone industry remains subdued. On the demand side, global smartphone sales have declined for several consecutive weeks during the second quarter of...
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Infineon and InnoScience's GaN patent fight hardens market split

Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins...