Taiwan Semiconductor Manufacturing Company (TSMC) held its annual shareholders meeting on June 3, 2025, where Chairman C.C. Wei addressed questions on regulatory compliance, information...
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei firmly denied speculation that the company is considering setting up a fab in the Middle East.
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei addressed key concerns on June 3, 2025, during a shareholder meeting, touching on currency volatility, global trade...
The tariff war has temporarily paused, but the biggest challenge currently facing the semiconductor and technology industries is the sharp appreciation of the New Taiwan dollar (NT$)...
As much of the world's manufacturing sector stalls under macroeconomic strain and geopolitical uncertainty, Taiwan is experiencing an extraordinary export boom—driven not by...
Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business...
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Samsung Electronics' Device Solutions (DS) division has appointed former TSMC and NXP Semiconductors executive Margaret Han as vice president of its North American wafer foundry business,...
Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While...
Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...
Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...
