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Wednesday 19 August 2026
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek

Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions...

Wednesday 19 August 2026
Airoha, MediaTek back IC Plus against Realtek in switches

Ethernet chipmaker IC Plus said on August 17 that its operations in 2026 have improved significantly after Airoha Technology took a...

Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run

The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...

Wednesday 19 August 2026
LG's raw material costs jump by over KRW1 trillion in 1H26, auto components hit hardest

Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

Wednesday 19 August 2026
Samsung, SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term...

Wednesday 19 August 2026
Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...

Wednesday 19 August 2026
AI drives EISO high-end PCB orders as CCL shortages bite

Niche printed circuit board (PCB) maker EISO Enterprise said that 2026 industry demand has returned to post-pandemic highs as AI applications...

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Wednesday 19 August 2026
Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed...

Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue

Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to...

Wednesday 19 August 2026
US pushes South Korea to prioritize memory chip investment in trade talks
US officials have pressed South Korea to make memory chip manufacturing its first strategic investment in the US, according to a report cited by JoongAng Daily. The claim...
Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...

Tuesday 18 August 2026
Rockchip profit jumps 62% as edge AI chips scale across devices

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427...

Tuesday 18 August 2026
VeriSilicon revenue surges 91% as AI ASIC backlog swells to US$1.85B

VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand...