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Friday 20 March 2026
Memory price surge drives Transcend's 15x profit growth in January 2026
Memory module maker Transcend reported a remarkable profit increase for January 2026, with net income reaching NT$2.786 billion (approx. US$87.2 million), up 1578% year-over-year....
Friday 20 March 2026
Samsung plans over KRW110 trillion investment in AI semiconductor facilities and R&D for 2026
Samsung Electronics announced it will invest more than KRW110 trillion (approx. US$73.4 billion) in facilities and R&D by 2026 to secure a leading position in the AI semiconductor...
Friday 20 March 2026
Nvidia and AWS strike massive GPU supply deal through 2027

On March 19, senior executives at Nvidia said the company has reached an agreement with the cloud computing division of Amazon to supply...

Friday 20 March 2026
Samsung foundry shows signs of stabilization as Nvidia, Tesla orders underscore AI chip capabilities

Samsung Electronics' foundry business is showing signs of stabilization after a sustained period of market share decline, as new orders...

Friday 20 March 2026
HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...
Friday 20 March 2026
When secrets walk out the door: TSMC's cross-border IP battle tests Taiwan's legal reach
TSMC built its dominance not just on cutting-edge fabs, but on closely guarded know-how that rivals cannot easily replicate. Now, that edge is at the center of a high-stakes legal...
Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...
Friday 20 March 2026
As NAND makers move on, MLC memory nears the end of the line

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

Friday 20 March 2026
Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
Friday 20 March 2026
UK-Taiwan R&D ties scale up with Foxconn, Turing Space, NSYSU
Taiwan has long leveraged its manufacturing strengths to carve out a place in the global supply chain. Now, it is going further. With research and development reach expanding overseas,...
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
Friday 20 March 2026
Allied Circuit sees server, IPC market growth boosting 2H26 outlook
Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in...
Friday 20 March 2026
Commentary: Taiwan's display panel makers are quietly becoming chip companies
Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.
Friday 20 March 2026
Intel pushes large-area AI packaging to close foundry gap
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
Friday 20 March 2026
Lumotive creates world's first 2D photonic beamforming chip
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world's first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light...