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Thursday 18 September 2025
SpaceX advances D2D plans with EchoStar spectrum deal

SpaceX is reportedly working with semiconductor manufacturers to develop a custom chip that will enable its upcoming direct-to-device...

Thursday 18 September 2025
Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...
Thursday 18 September 2025
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Wednesday 17 September 2025
Taiwan's MPI, WinWay, and Chunghwa Precision join advanced chip test race
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Wednesday 17 September 2025
SMIC initiates testing of domestically produced lithography machines to bypass US sanctions
In response to US export controls and to reduce reliance on ASML, China has begun testing its first domestically manufactured deep ultraviolet (DUV) lithography machine. According...
Wednesday 17 September 2025
South Korea promotes SiC power semiconductor technology autonomy, eyeing EV-driven growth
The South Korean government recently announced several industrial growth plans, including support programs for the localization of silicon carbide (SiC) power semiconductors. The...
Wednesday 17 September 2025
Taiwan semiconductor industry holds home advantage, says economics minister
Taiwan's AI server exports have doubled, with manufacturers' GPU and graphics card production capacity fully booked, driving remarkable export growth for the country. Minister of...
Wednesday 17 September 2025
Commentary: Handcuffing workers shocks South Korea; MAGA strategy risks backfiring
On July 30, 2025, US President Donald Trump announced that the US would reduce the "reciprocal tariff" rate imposed on South Korea from 25% to 15%. In return, South Korea pledged...
Wednesday 17 September 2025
Commentary: Smartphone chipmakers rebrand as Qualcomm, Apple, MediaTek, and Xiaomi refresh product names to stay competitive
Qualcomm will unveil its latest Snapdragon flagship mobile platform next week and has officially confirmed the chip will be called Snapdragon 8 Elite Gen 5. The move comes as part...
Wednesday 17 September 2025
SK Hynix leads South Korean companies in operating profit and tax payments in 1H25
In the first half of 2025, SK Hynix recorded the highest operating profit and the largest corporate tax payment among South Korean companies. The surge in demand for high-bandwidth...
Wednesday 17 September 2025
Tesla, Valens deals boost Samsung Foundry in 4nm race against TSMC
Samsung Electronics' foundry business is quietly expanding its client roster after securing a landmark US$16.5 billion contract with Tesla in July 2025 to manufacture AI chips. Analysts...
Wednesday 17 September 2025
Memory prices surged in 4Q25, defying seasonal trends as AI drives demand
Driven by strong AI demand, memory contract prices for NAND and DRAM rose sharply by an estimated 15-20% in the fourth quarter of 2025, breaking traditional year-end price decline...
Wednesday 17 September 2025
Qualcomm dominates physical AI with robot and automotive chips
Robots and self-driving cars are driving the emergence of "physical AI," a new era of on-device processing that's shifting focus away from cloud-based large language models. According...
Wednesday 17 September 2025
China's TI anti-dumping probe likely more symbolic than punitive
China is reportedly probing whether US-made analog chips are being dumped into its market, a move widely seen as targeting Texas Instruments (TI), the dominant US supplier of analog...
Wednesday 17 September 2025
China's Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...