中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China's OLED capacity expansion threatens South Korea's auto and IT panel lead
Tomorrow's Headlines
10h 22min ago
China plans 6x AI computing expansion in five years, eyes 100,000-card clusters
Tomorrow's Headlines
10h 22min ago
Exclusive: European automakers reportedly expand China software teams despite layoffs
Tomorrow's Headlines
10h 22min ago
Chinese automakers face a crucial test in global localization
Tomorrow's Headlines
10h 22min ago
Analysis: Huawei and Xiaomi push China’s chipmaking race into a new phase
Tomorrow's Headlines
10h 22min ago
Mature-node chip shortages may last until 2028, turning supply chain management into a pricing lever
Tomorrow's Headlines
10h 22min ago
NEWS TAGGED SEMICONDUCTOR
Wednesday 19 August 2026
BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
Introduction
Thursday 6 August 2026
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Introduction
Wednesday 5 August 2026
Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
Introduction
Friday 24 July 2026
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
Introduction
Friday 3 July 2026
Megawatt AI Racks: Infrastructure Evolution & Wide-Bandgap Power Semiconductor Opportunities by 2030
Introduction
Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Friday 5 June 2026
Global top-3 memory maker status, 2Q 2026: Surging prices and AI demand lock in a strong memory seller's market
Introduction
Tuesday 2 June 2026
Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP
Introduction
Monday 25 May 2026
Taiwan, China wafer foundry industry, 2Q 2026: Cross-strait revenues to surge over 25%
Introduction
Wednesday 13 May 2026
Global smartphone AP industry, 1Q 2026: Memory price hikes pressure smartphone AP market
Introduction
Monday 20 April 2026
Global wafer foundry industry and status, 2026: AI-driven growth and fierce competition
Introduction
Thursday 16 April 2026
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
Introduction
Monday 30 March 2026
Taiwan wafer foundry industry, 1Q 2026 and 2026 forecast
Introduction
Friday 20 March 2026
Global top-3 memory maker status, 1Q 2026
Introduction
Monday 16 March 2026
Global smartphone AP industry, 4Q 2025
Introduction
1/2
pages
1
2
BIZ FOCUS
Sep 8, 08:00
Shining a Light on the Precision Behind AI and Data Infrastructure
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
MOST-READ
7 DAYS NEWS
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first
