Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Memory backend specialist Powertech Technology (PTI) has recently obtained wafer bumping orders for networking chips from Broadcom and MediaTek, indicating a significant payoff in...
Chipmakers including Broadcom, Qualcomm and MediaTek have entered the early stages of developments for their respective Wi-Fi 7 (802.11be) chips, according to industry sources.
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
TSMC's board of directors has approved a budget of about US$2.89 billion for installation of mature technology capacity, the pure-play foundry announced on April 22.
Chipmakers are set to roll out Wi-Fi 6E chip solutions in the second half of the year, bringing new business opportunities for IC test and certification labs including Sporton Inte...
Some networking chip vendors, such as Broadcom, have extended their delivery lead times to as long as 50 weeks due to the tight supply of critical parts and components, heralding...
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photonics Epitaxy (VPEC) and Intelligent...
TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
