CONNECT WITH US
NEWS TAGGED BGA
Thursday 12 March 2020
Micron samples uMCP with LPDDR5
Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...
Thursday 27 December 2018
China OSAT firms foraying into higher-end packaging fields
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Tuesday 26 June 2018
Micron begins volume production of GDDR6
Micron Technology has announced volume production on its 8Gb GDDR6 memory, which is optimized for a variety of applications that require high performance memory including artificial...
Wednesday 31 January 2018
Logic IC packager Greatek upbeat about revenues for 2018
After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Monday 15 January 2018
IC packager Greatek eyes revenues rise on more international orders in 1Q18
Taiwan-based logic IC packaging and testing specialist Greatek Electronics is expected to enjoy stable revenue growth in the first quarter of 2018 from increasing ratio for orders...
Tuesday 8 August 2017
Macronix intros new OctaFlash to power instant-on applications
Macronix International has announced its new Ultra-OctaFlash Memory designed to meet the growing demand for "instant-on" performance and real-time system responsiveness in automotive,...
Wednesday 1 June 2016
Samsung announces mass production of 512GB NVMe SSD in single BGA package
Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe SSD solutions in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebooks, according...
Thursday 3 December 2015
New FC BGA substrate plant to boost Unimicron 2016 revenues, says report
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350...
Thursday 12 February 2015
InnoDisk smart flash memory storage solutions aiming for IoT devices
IoT devices, which have been receiving a great deal of attention from the global ICT industry have several major characteristics: versatility, reliability, security, small-size, mobility...
Friday 21 December 2012
Intel likely to figure a way to keep LGA design for CPUs, says Asustek executive
Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of...
Tuesday 22 March 2011
Digitimes Insight: Japan earthquake impact on IC packaging industry
Though several major IC packaging material suppliers have resumed operations at their earthquake-affected plants, there is still growing concern that production will be hampered by...
Friday 7 January 2011
Nanya PCB to slash capex in 2011
Nanya PCB (NPC) plans to drop its capital spending from NT$5 billion (US$171 million) in 2010 to less than NT$1 billion in 2011, as most of its investment for expanding capacity for...
Tuesday 9 March 2010
PTI seeking clarity on ITC ruling in Tessera DRAM case
Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...
Wednesday 10 February 2010
Solder material supplier Shenmao enjoys sequential revenue growth in January
Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...
Thursday 24 December 2009
ChipMOS loses DRAM packaging patent lawsuit against Walton
Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...