Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
As SEMICON Taiwan 2025 nears, ASE Technology's COO Tien Wu highlighted the semiconductor industry's decade-long outlook, stressing challenges in reshaping the value chain in the post-AI...
ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...
At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
Amkor and ASE, two of the world's top semiconductor packaging and testing providers, are deepening their US presence following the return of Trump-era "Made in America" policies....
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
Since US President Donald Trump championed the "Made in America" initiative, technological competition between the US and China has intensified, rapidly escalating global geopolitical...
As the US enters a new phase of tariff enforcement—with the buffer period on reciprocal tariffs nearing expiration—concerns are growing that the global semiconductor industry's...
