Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...

Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...

Taiwan-based backend equipment supplier All Ring Tech is optimistic about its business prospect for 2020 as it has tapped into the supply chains of Taiwan's leading wafer foundry...

Taiwan-based IC testing interface supplier WinWay Technology has entered the supply chains of major chipmakers in the US and China with high-end customized IC sockets and will venture...

Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...

China has recently offered to allow Taiwan-based firms to join the country's 5G technology R&D, standards formulation, network construction and product test, but most Taiwanese...

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Global chipmakers are keenly developing Wi-Fi 6 chip solutions to support sub-6-GHz 5G smartphones, the mainstream new-generation models estimated to register annual shipments of...

Taiwan-based fabless chipmakers and backend houses are all gearing up to tap robust demand for 5G-related applications from China, where local major telecom carriers have started...

IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...

ASE Group has developed an Ansys customization toolkit (ACT) workflow to enhance its IC packaging and development process.

Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...

Japan IDM Rohm Semiconductor will strengthen sales of power components for industrial and automotive applications in Taiwan through local distribution agents, seeing opportunities...

Taiwan's chipmaking industry, led by TSMC, is gearing up to enter its next stage of growth as chip demand for 5G applications is set to start ramping up substantially next year, according...

ASE Technology is expected to see its revenues grow quarter by quarter into 2020 thanks to strong packaging demand from major clients including Apple, Huawei's HiSilicon, MediaTek...

Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...

TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...

The annual Semicon Taiwan tradeshow will take place in Taipei from September 18-20, with this year's theme focusing on cutting-edge technologies enabling the semiconductor industry...