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NEWS TAGGED ASE
Wednesday 18 May 2022
Equipment maker All Ring lands significant orders for advanced packaging
Fab toolmaker All Ring Tech has landed significant orders from chipmakers, such as TSMC and ASE Technology, which have stepped up their advanced packaging capacity expansions, according...
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Monday 9 May 2022
ASE sourcing more aQFN leadframes for Wi-Fi 6/6E/7 SoCs
ASE Technology has landed big orders from Qualcomm and MediaTek for processing their Wi-Fi-Fi SoCs with its unique aQFN (advanced quad flat no-lead) technology, and is actively seeking...
Thursday 5 May 2022
Silicon Labs working closely with Taiwan foundries, OSATs
Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
Friday 29 April 2022
OSAT ASE upbeat about demand for automotive, HPC and network ICs
Taiwan-based OSAT ASE Technology expects demand for automotive, HPC and network ICs to stay robust and buoy further its sales performance in the second quarter and the second half...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Monday 18 April 2022
Intel may farm out PC chipsets processing to OSATs in Taiwan
Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Thursday 7 April 2022
IC packaging leadframe, substrate prices to rise in 2Q22
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...