TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Taiwan-based OSATs such as ASE Technology, and IC test interface specialists including Chunghwa Precision Test Tech (CHPT) and WinWay Technology, have all expanded their operations...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Many Taiwan-based OSATs, including ASE Technology Holding (ASEH), have reported declines for April sales, but Powertech Technology (PTI) and Ardentec saw some positive results in...
With unclear business outlook from Taiwan's mobile SoC vendor MediaTek, its backend partners including ASE Technology, Powertech Technology (PTI), Sigurd Microelectronics and King...
OSAT ASE Technology (ASE) anticipates a return to 80% plant utilization in the second half of 2023, up from 60% in the first half of the year. After the third quarter, the business...
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
ASE Technology (ASEH) and Amkor Technology, the world's top two OSATs, have both expanded production outside of China and Taiwan, according to industry sources.
OSATs are striving to offload "wafer bank" inventories stored for customers, and are generally pessimistic about their sales prospects for the second and third quarters, according...
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry...
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...
Radio-frequency (RF) and power amplifier (PA) chip suppliers have noticed a slight pick-up in orders for Android smartphones as related brand vendors prepare for China's approaching...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
