TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous...
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
A nationwide lockdown in Malaysia has made disruptions to the output from local chip plants, which fulfill mainly orders for entry-level and mid-range logic ICs, and power diodes...
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Skyworks will be stepping up its RF power amplifier (PA) production outsourcing to Taiwanese partners to fulfill orders placed by China-based smartphone vendors, while providing its...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Taiwan-based IC design houses have notified their customers about price hikes in the second half of 2021 to reflect rising manufacturing costs, according to industry sources.
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...
