OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources.
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Backend firms have received engineering samples of next-generation smartphone APs from vendors such as Qualcomm and MediaTek, and expect a particularly strong first-quarter 2022 for...
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Taiwan's OSATs are expected to sustain tight capacity supply for chip probing and final test operations through 2022, as the visibility of their orders, particularly from international...
Taiwan chip vendors including MediaTek will continue to play an influential role in the global high-tech sectors in 2022 with major advantages including strong IC design prowess,...
