Tuesday 7 November 2023
ASE, TSMC eyeing SiPh
Major Taiwanese semiconductor firms, such as TSMC and ASE Technology, have been working on silicon photonics (SiPh), which could propel Taiwan to the forefront of the sector.
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Tuesday 24 October 2023
Chinese SiC players rising rapidly, likely to change global market landscape
In the near future, Chinese players in the silicon carbide (SiC) sector will have the opportunity to break the current shortage of mainstream 6-inch wafers and usher in a new landscape...
Wednesday 18 October 2023
USI sees supply-side challenges facing future cars
Future cars have emerged as a major global technology trend, but chip shortages and other supply-side issues may hinder progress, according to Universal Scientific Industrial (USI),...
Thursday 12 October 2023
Backend firms upbeat about demand for new PS5
Backend companies are positive about demand for Sony's new slimmed-down PlayStation 5 (PS5), which will hit the shelves in mid-November, according to industry sources.
Thursday 12 October 2023
OSATs to see AI chip demand fuel growth in 2024
Although major Taiwan-based OSATs experienced a decline in total revenue for 2023 through September, market sources state that they are gearing up for an anticipated rise in demand...
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Thursday 14 September 2023
ASE, USI manufacture S9 SiP for new Apple Watch
The new S9 system-in-package (SiP) that powers the just-unveiled Apple Watch is manufactured by Advanced Semiconductor Engineering (ASE) and Universal Scientific Industrial (USI),...
Wednesday 13 September 2023
IC backend houses to see demand recovery in 2024
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Wednesday 13 September 2023
Apple's competitors conservative about 2024 handset market, say OSATs
Apple's competitors in the handset market are making conservative production plans for next year, as they have yet to see a clear picture of 2024, according to sources at OSATs.
Thursday 7 September 2023
ASE subsidiary USI sees Poland as first step of EMEA strategy
The 2023 EU-Taiwan Investment Partnership Forum on Semiconductor Clusters, taking place on Sep. 7 on the sidelines of SEMICON Taiwan, saw new dynamics injected following the passage...
Wednesday 30 August 2023
ASE reportedly pursuing CoW certification
OSAT ASE Technology reportedly is seeking to secure chip-on-wafer (CoW) packaging certification from Nvidia for its Kaohsiung plant in southern Taiwan, according to industry source...
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