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NEWS TAGGED ANTENNA
Wednesday 4 December 2019
MPI, LCP materials for smartphone antennas to coexist
Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the...
Tuesday 3 December 2019
Market of RF components for telecom infrastructure to be shaken by active antenna systems, says Yole
The radio frequency (RF) front-end (FE) market for telecom infrastructure, estimated at US$1.47 billion in 2018, is forecast to reach US$2.52 billion in 2025, according to Yole Dev...
Monday 2 December 2019
Chipmakers, partners moving to secure 5G key components inventory
Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated...
Friday 29 November 2019
Cooling module makers eyeing robust application demand for 5G devices
The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...
Tuesday 26 November 2019
SiP, AiP processes to gain momentum for 5G applications in 2020
System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...
Friday 22 November 2019
Taiwan firms ready for production of LCP-based flexible antenna boards
Major Taiwan-based flexible PCB specialists have had their respective production lines for LCP (liquid crystal polymer) antenna boards ready for commercial runs as they are eyeing...
Monday 18 November 2019
PCB production lines may remain humming during Lunar New Year
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...
Friday 15 November 2019
ShunSin to ramp up capex in 2020 for SiP capacity expansion
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...
Thursday 14 November 2019
TSMC to build advanced packaging fab in northern Taiwan in 2020
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
Wednesday 13 November 2019
PCB maker Zhen Ding plans record capex for 2020
Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments...
Wednesday 6 November 2019
Taiwan backend firms expanding testing capacities for 5G chipsets
Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Thursday 31 October 2019
Flexium set to reap well from MPI, LCP antenna boards in 2020
Taiwan-based flexible PCB maker Flexium Interconnect expects its revenues from shipments of high-frequency MPI (modified polyimide) and LCP (liquid crystal polymer) antenna boards...
Thursday 24 October 2019
CCL maker Ventec eyes 5G as largest growth driver in 2020
Taiwan-based niche-type CCL supplier Ventec Electronics expects 5G applications to be its largest revenue growth driver in 2020 as the company is set to enter volume production of...
Tuesday 22 October 2019
Taiwan backend supply chain ramps up support for HiSilicon 5G chips
Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...
Monday 14 October 2019
ASE Technology to see growth momentum carry into 2020
ASE Technology is expected to see its revenues grow quarter by quarter into 2020 thanks to strong packaging demand from major clients including Apple, Huawei's HiSilicon, MediaTek...