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Thursday 9 January 2020
Chinese PCB makers accelerating capacity expansions to meet 5-G driven demand
Major Chinese PCB makers are speeding up capacity expansions seeking to better meet fast-growing demand for applications to 5G, terminal devices and automotive electronics in China,...
Thursday 9 January 2020
PCB maker Zhen Ding posts record revenues for 2019
Taiwan's leading PCB maker Zhen Ding Technology saw its revenues climb 1.47% on year to a record high of NT$120.22 billion (US$4 billion) in 2019, with industry sources saying the...
Thursday 2 January 2020
TSMC reportedly lands InFO_AiP orders for 5G mmWave iPnones
As US leading chipmakers and system vendors are gearing up to commercialize their mmWave technologies, TSMC reportedly has landed a big order from Apple for processing handset antenna...
Thursday 2 January 2020
CCL makers to see sharp increases in shipments for 5G base stations in 2020
Taiwan-based CCL makers including Iteq, Taiwan Union Technology and Ventec International may see their shipments for 5G base station applications to double in 2020 as China and South...
Friday 27 December 2019
CCL makers poised to reap 5G application opportunities in 2020
Taiwan-based CCL makers including Elite Material, Taiwan Union Technology, Iteq and Ventec International have raced to send high-frequency, high speed CCL samples to clients for validation...
Friday 27 December 2019
TSMC to launch InFO-AiP volume production for mmWave devices in 2020
TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Monday 23 December 2019
CCL maker Ventec expects 2019 gross margin to be over 25%
Taiwan-based niche-type CCL maker Ventec International expects its gross margin to reach over 25% for whole-year 2019 thanks to volume production of its new high-end materials and...
Friday 20 December 2019
Semiconductor tech to be more important in future 5G and AI applications
While 5G and AI will dominate new emerging tech applications to create cash flows for enterprises in the next decade, relevant semiconductor materials and technologies will not only...
Friday 13 December 2019
IC substrate suppliers see clear order visibility stretch into 2020
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Thursday 12 December 2019
Foxconn subsidiaries push into 5G businesses
Now that Young Liu has taken the helm, the Foxconn Technology Group (Hon Hai Precision Industry) has begun a series of transformations targeting the business opportunity from 5G,...
Wednesday 11 December 2019
Zhen Ding to build capacity for SiP, AiP substrates
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Wednesday 11 December 2019
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Tuesday 10 December 2019
Flexible PCB makers gearing up for 5G iPhone antenna orders
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Friday 6 December 2019
LTCC to be mainstream packaging material for mmWave modules
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...