In October 2024, South Korean media reported that Intel's CEO, Pat Gelsinger, aimed to meet Samsung's chairman, Lee Jae-Yong, to discuss a foundry alliance that would involve sharing...
Huawei's Harmony Intelligent Mobility Alliance (HIMA) is setting its sights on a 1 million-unit sales target in 2025. The alliance's four key brands—AITO (Seres Group), Luxeed...
The proposed merger between Honda and Nissan has taken an unexpected turn, with reports emerging that talks, initially called off, could be revived. In a surprising move, Honda is...
The emergence of generative AI (GenAI) has triggered a surge in AI server demand, leading to severe Nvidia GPU shortages. The resulting profit windfall far exceeds that of the previous...
The strengthening alliance between MediaTek and Nvidia has drawn intense industry attention, particularly regarding their joint development of AI PC platforms. While MediaTek has...
Taiwan's drone manufacturers are making significant strides in reaching global supply chains, despite facing challenges similar to other domestic industries where small and medium-sized...
Zettabyte has reinforced its strategic expansion by partnering with Foxconn, following its prior alliance with Wistron. This partnership is aligned with Zettabyte's financing initiatives...
Nanya Technology has greenlit a strategic alliance with DRAM design firm PieceMakers Technology, committing up to NT$6.6 billion (US$1.5 million) in a cash capital increase to secure...
Progate Group Corporation (PGC) collaborated with professional testing company Vate Technology (Vate) to establish a strategic partnership and enhance their testing service capacity...
Two years ago, NXP and Inventec announced their strategic alliance in the automotive electronics sector. They have further revealed plans to establish an automotive ultra-wideband...
The Taiwan Drone Excellence Overseas Business Alliance, established in late 2024, has secured Poland as its second "ally" after Oklahoma, US. The partnership aims to advance international...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
