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Tuesday 7 October 2025
From rival to partner: how AMD found its answer to the Nvidia-Intel pact
AMD has entered into a multi-year, multi-generation AI chip supply agreement with OpenAI that could generate the chipmaker hundreds of billions of dollars in revenue. The deal also...
Friday 3 October 2025
AI Automotive Industry Alliance debuts in Taiwan, targeting autonomous logistics as first step in next-gen mobility integration
As electric and autonomous vehicle technologies reshape global mobility, Taiwan has officially launched the AI Automotive Industry Alliance on October 1, 2025. The new coalition brings...
Friday 3 October 2025
Taiwan forms AI automotive alliance to build trillion-dollar smart vehicle industry
The Taiwan Automotive International Forum & Exhibition (TAIFE) launched an AI automotive industry alliance on October 1, 2025, marking a collaborative effort between the government,...
Monday 22 September 2025
Nvidia-Intel US$5B deal shakes up chip industry and puts TSMC on edge

Nvidia and Intel's new partnership is reshaping the global semiconductor landscape and raising questions about how it could influence...

Friday 19 September 2025
Intel–Nvidia pact fuses x86 and RTX, bolstering Tan’s turnaround strategy
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
Friday 19 September 2025
Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry

NVIDIA has announced it will invest US$5 billion in Intel, purchasing shares at US$23.28 each. The move surprised no one in the semiconductor...

Tuesday 16 September 2025
TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Saturday 13 September 2025
Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Friday 12 September 2025
Sysgration, Quantum Systems form alliance to localize drone production in Taiwan
Sysgration announced on September 11 a strategic alliance with Germany's Quantum Systems to co-develop AI-powered edge computing and unmanned aerial solutions. The partnership also...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Thursday 4 September 2025
Resonac launches JOINT3 alliance to develop next-gen semiconductor tech
Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
Thursday 4 September 2025
Unlikely alliance launches US$24M push into Taiwan’s robotics market
A surprising new alliance is disrupting Taiwan's robotics and unmanned vehicle industry. A veteran food manufacturer, a key supplier to TSMC, and a leading machinery firm have joined...
Friday 29 August 2025
TSMC to tighten supplier audits, targeting firms with deep China ties ahead of 2nm rollout
Reports of TSMC halting Chinese equipment use and auditing Taiwanese suppliers have raised concern. The company said it does not comment on rumors, stressing its focus on risk management...
Wednesday 27 August 2025
Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks
Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...