Monday 13 November 2023
Government incentives for developing semiconductor industry (3): Subsidies for R&D activities
Cash subsidies targeting research and development (R&D) investments and R&D consortiums are conducive to the development of semiconductor technologies, so governments can...
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Tuesday 3 October 2023
Taiwanese firms largely missing from Huawei's SparkLink Alliance spotlight
Recently, with the guidance of Richard Yu, the CEO of Huawei's Consumer BG and chairman of the Intelligent Automotive Solution BU, China's indigenous next-gen short-range wireless...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Friday 22 September 2023
IC design houses endure fierce competition from automotive IC IDMs
Despite the fierce competition among automotive IC IDMs promoting their respective highly integrated chip platforms, Taiwanese IC design companies continue to push through in the...
Friday 1 September 2023
Taiwan makers in chip supply chain form alliance to expand in US market
Ten Taiwan-based companies in the chipmaking supply chain have formed an alliance to expand their presence in the US market.
Tuesday 29 August 2023
Taiwanese display firms join hands to provide solutions for bookstore
Taiwan-based active-matrix (AM) miniLED flexible display provider PanelSemi, a subsidiary of Innolux, has partnered with E Ink, RapidSignage, and TopRGB Opto to release AM miniLED...
Wednesday 2 August 2023
Nvidia, Apple, and Pixar establish 3D content OpenUSD Alliance
Nvidia, together with Apple, Pixar, Adobe, Autodesk, and the Linux Foundation's subsidiary, the Joint Development Foundation (JDF), recently announced the formation of the OpenUSD...
Wednesday 26 July 2023
Nissan to invest $663 million in renault EV unit as alliance rejigged
Nissan Motor Co. has finalized plans to invest in Renault SA's electric-vehicle venture Ampere, capping months of negotiations to rebalance the troubled automotive alliance.
Tuesday 27 June 2023
Samsung's investment in Japan: advantages and disadvantages
Following the G7 Summit held May 19–21 in Hiroshima, the geopolitical war surrounding semiconductors is heating up in Northeast Asia. In response to the increasing intensity...
Friday 2 June 2023
Keysight joins TSMC OIP 3D Fabric Alliance
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Tuesday 30 May 2023
LG teams up with Korean peers to work on 3D AR glasses
South Korean companies including LG Electronics are moving to collectively roll out augmented reality (AR) glasses with 3D images in cooperation with Qualcomm, and are expected to...
Monday 29 May 2023
Ayar Labs raises another US$25 million in latest funding round
Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...
Thursday 20 April 2023
China IC alliance calls for long-term planning for semiconductor industry
China's Integrated Circuit Industry Technology Innovation Alliance (ICTIA) has called for long-term planning for the development of the country's semiconductor industry, instead of...
Friday 14 April 2023
Stellantis not leaving metaverse even after Foxconn alliance; E-Lead's 3D AR-HUD is first step
The automotive supply chain market stated that MobileDrive, the joint venture between Stellantis and Foxconn, is planning to build an augmented reality (AR) navigation system inside...
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