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Thursday 30 October 2025
South Korea agrees to US energy investments in exchange for tariff reductions
US President Donald Trump has approved South Korea's construction of a nuclear-powered submarine at the Philadelphia Naval Shipyard in an effort to strengthen their alliance. South...
Wednesday 29 October 2025
Foxconn expands US AI server buildout, joins Nvidia-Stellantis-Uber robotaxi effort

Hon Hai Technology Group (Foxconn) used this week's GTC event in Washington to highlight two fronts of collaboration with Nvidia: expanding...

Tuesday 28 October 2025
US-Japan summit signs rare earths deal and promises golden age alliance
On the morning of October 28, 2025, Japanese Prime Minister Sanae Takaichi and US President Donald Trump signed two important agreements during their meeting at the Akasaka Palace...
Tuesday 28 October 2025
Chunghwa Precision, Yokowo sign investment deal to deepen Taiwan-Japan testing industry ties
Taiwanese semiconductor test interface leader Chunghwa Precision Test Tech (CHPT) announced that it has signed an investment agreement with Japan's Yokowo. Under the agreement, both...
Saturday 18 October 2025
ams OSRAM, Nichia expand patent alliance covering GaN LED and laser technologies
Global sensor leader ams OSRAM and LED powerhouse Nichia have expanded their two-decade intellectual property (IP) partnership through a new cross-license agreement. Signed by ams...
Tuesday 7 October 2025
From rival to partner: how AMD found its answer to the Nvidia-Intel pact
AMD has entered into a multi-year, multi-generation AI chip supply agreement with OpenAI that could generate the chipmaker hundreds of billions of dollars in revenue. The deal also...
Friday 3 October 2025
AI Automotive Industry Alliance debuts in Taiwan, targeting autonomous logistics as first step in next-gen mobility integration
As electric and autonomous vehicle technologies reshape global mobility, Taiwan has officially launched the AI Automotive Industry Alliance on October 1, 2025. The new coalition brings...
Friday 3 October 2025
Taiwan forms AI automotive alliance to build trillion-dollar smart vehicle industry
The Taiwan Automotive International Forum & Exhibition (TAIFE) launched an AI automotive industry alliance on October 1, 2025, marking a collaborative effort between the government,...
Monday 22 September 2025
Nvidia-Intel US$5B deal shakes up chip industry and puts TSMC on edge

Nvidia and Intel's new partnership is reshaping the global semiconductor landscape and raising questions about how it could influence...

Friday 19 September 2025
Intel–Nvidia pact fuses x86 and RTX, bolstering Tan’s turnaround strategy
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
Friday 19 September 2025
Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry

NVIDIA has announced it will invest US$5 billion in Intel, purchasing shares at US$23.28 each. The move surprised no one in the semiconductor...

Tuesday 16 September 2025
TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Saturday 13 September 2025
Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Friday 12 September 2025
Sysgration, Quantum Systems form alliance to localize drone production in Taiwan
Sysgration announced on September 11 a strategic alliance with Germany's Quantum Systems to co-develop AI-powered edge computing and unmanned aerial solutions. The partnership also...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...