In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...

Samsung Electronics is on track to expand production cutbacks on both DRAM and NAND flash chips to accelerate a memory market rebound in the second half of 2023, after its Device...

Elite Material Corporation (EMC) recently made Insulectro its exclusive distributor in North America. The agreement along with the high computing power required by large language...

PCB maker Unimicron Technology will focus on developing AI-related and high-performance computing (HPC) high-speed transmission network communications applications in the future,...