Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros...

Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...

Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...

ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...