Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) approved recently capital appropriations of about US$20.94 billion for the installation and upgrade of advanced technology...

Nuvoton Technology remains optimistic that its shipments of 32-bit MCUs, server baseboard management controllers (BMCs), automotive battery management ICs (BMICs), and power management...

Taiwan's leading OSAT ASE Technology expects revenues from backend services for automotive chips to break a landmark level of US$1 billion in 2022 after growing 60% on year in 2021...

The ongoing COVID-19 pandemic has caused bottlenecks in labor relations, transport, and logistics operations worldwide, which may lead to delays in foundries' installation of new...

Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...

TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...

AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...

ESD (electrostatic discharge) protection components have become increasingly crucial peripheral chips for handset and metaverse devices, spurring great demand for micro-packaging...

TSMC has introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products.

Taiwan-based IC backend equipment specialists, particularly those specializing in advanced packaging equipment, are poised to generate record-high sales in 2021, buoyed by robust...

OSAT company ASE Technology has disclosed plans to sell part of its factory operations in China for over US$1 billion.

TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...

In the notebook processor supply chain, ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting...

ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...