Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
GaAs foundry Advanced Wireless Semiconductor Company (AWSC) has notified its clients about an around 10% hike in its 6-inch foundry quotes, according to industry sources.
Taiwan-based power diode and MOSFET makers including Panjt International and Taiwan Semiconductor have seen delivery lead times extended to as long as six months due mainly to tight...
GlobalWafers has run all its production lines for 12-, 8- and 6-inch silicon wafers at full capacity, according to company chairperson Doris Hsu. The silicon wafer supplier plans...
Vertically-integrated LED maker Tyntek has completed 6-inch epitaxial wafer production capacity for producing customized Si-based sensor chips mainly, and expects to gradually obtain...
Taiwan-based silicon wafer manufacturers including GlobalWafers and Wafer Works have seen orders for 6-inch wafers ramp up and fill their factory capacities, according to industry...
Taiwan's III-V semiconductor supply chain players are gearing up to deepen deployments in the segment of GaN-based power components and RF modules increasingly applied to 5G handsets...
HLJ Technology has disclosed it has installed production capacity for 6-inch VCSEL epitaxial wafers and chips, increasing monthly capacity by 250 million VCSEL chips.
Diode maker Eris Technology expects its profits to surge in 2021-2022 with gross margin likely to top 40% thanks to continuous production cost reductions enabled by new manufacturing...
GlobalWafers will sustain full capacity utilization for its 12- and 8-inch wafer production lines at least throughout the end of 2020, with its 6-inch wafer capacity over 70% utilized,...
The Wi-Fi 6 penetration rate is likely to advance to 50-60% in 2021 with the latest wireless communication standard increasingly adopted for handsets, routers and notebooks, prompting...
Macronix International, a supplier of mask ROM and flash memory, expects its in-house developed 48-layer 3D NAND products to start generating revenue in 2021.
International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...
Tainergy Tech has no plans to forge any strategic alliance with players in the third-generation semiconductor sector for the moment, according to the firm's president Kevin Hsieh.
HLJ Technology, a Taiwan-based supplier of VCSEL chips for Apple AirPods, has nearly completed construction of a 6-inch VCSEL wafer plant, with production to kick off in fourth-quarter...
