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NEWS TAGGED 45NM
Tuesday 20 April 2021
NAND flash controller supply remains tight
The supply of NAND flash controllers remains tight, constraining shipments of eMMC storage devices and SATA SSDs, according to industry sources.
Wednesday 19 August 2020
Huawei reportedly looking to build 45nm chip fabrication lines without US tech
China's Huawei reportedly is looking to build its own 45nm chip fabrication lines without US technology this year, which industry sources believe is "mission impossible."
Thursday 9 July 2020
Winbond enhances high-density NOR flash offering
Winbond Electronics has been stepping up its deployment in the high-density NOR flash field, gearing up for a boom in demand for 5G related applications, according to company president...
Monday 15 June 2020
Notebook demand remains robust, says Winbond chairman
Chip orders for notebooks are expected to stay robust until the end of the third quarter, according to Arthur Chiao, chairman for specialty DRAM and flash memory maker Winbond Elec...
Tuesday 23 April 2019
Globalfoundries, On Semi agree to transfer ownership of 300mm fab in New York
Globalfoundries and ON Semiconductor have entered into a definitive agreement for ON Semi to acquire a 300mm fab located in East Fishkill, New York, according to the companies.
Tuesday 16 April 2019
Semiconductor photomask sales reach record high of US$4 billion, says SEMI
Following a record-breaking 2017, worldwide semiconductor photomask sales set a new high of US$4.04 billion in 2018, according to SEMI.
Tuesday 18 December 2018
Fierce competition to drag down prices for TDDI chips, fingerprint sensors
Prices for TDDI (touch and display driver integration) solutions and optical fingerprint sensors will be dragged down by increasingly intense competition in both chip segments during...
Monday 15 October 2018
Advanced-node technology driving TSMC revenue per wafer, says IC Insights
The average revenue generated from processed wafers among the four biggest pure-play foundries - TSMC, Globalfoundries, UMC and SMIC - is expected to be US$1,138 in 2018 when expressed...
Thursday 10 May 2018
SMIC 1Q18 revenues miss guidance
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported revenues for the first quarter of 2018 reached US$831 million, up 5.6% sequentially and...
Monday 2 April 2018
SMIC profits fall 52% in 2017
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported revenues grew 6.4% on year to a record high of US$3.1 billion in 2017. Net profits, however,...
Monday 29 January 2018
Globalfoundries 45nm RF SOI offering ready for volume production
Globalfoundries' 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production, according to the pure-play foundry. Several customers are currently...
Tuesday 19 September 2017
GigaDevice signs wafer supply contract with SMIC
China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...
Wednesday 30 August 2017
GigaDevice draws investment from China state-backed fund
China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...
Monday 21 August 2017
Qualcomm to extend tie-up with TSMC, says executive
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
Thursday 23 February 2017
Globalfoundries announces availability of 45nm RF SOI to advance 5G mobile communications
Globalfoundries has announced the availability of its 45nm RF SOI (45RFSOI) technology offering, making it the first foundry to announce an advanced, 300mm RF silicon solution to...
Friday 4 May 2012
Samsung quad-core application processors
Samsung Electronics has introduced the industry's first quad-core application processor built on the HKMG low-power process technology. With performance capabilities exceeding 1.4GHz based on the ARM Cortex A9 quad-core, the Exynos 4 Quad allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20% lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual. Due to its 32nm HKMG low-power process and power-saving design, the Exynos 4 Quad has two-times the processing capability over the 45nm process based Exynos 4 Dual while consuming 20% less power. To improve power efficiency, Samsung adopted hot-plug functionality to support on-off switching for each core as well as the per-core dynamic voltage and frequency scaling (DVFS), which offers a dramatic reduction in power consumption by adapting different levels of voltage and frequency when changing workloads. Having identical form factor measurement (12X12X1.37mm), the Exynos 4 Quad is pin-to-pin compatible with the 32nm process based Exynos 4 Dual, allowing mobile device designers to immediately adopt the new solution without additional cost, engineering or design efforts. Already in production, the Exynos 4 Quad is scheduled to be adopted first into Samsung's next Galaxy smartphone that will officially be announced in May. Samsung's Exynos 4 Quad is also sampling to other major handset makers.