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NEWS TAGGED 3D PACKAGING
Wednesday 5 July 2023
Nvidia reportedly mulls outsourcing partial AI GPU production to Samsung
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
Monday 24 April 2023
Marvell demos 3nm data infrastructure silicon
Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm)...
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Friday 6 January 2023
Japanese manufacturers seize the opportunities of back-end processes
Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...