Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...