With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...

Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...

Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...

Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm)...

TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.

Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...