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NEWS TAGGED 28NM
Monday 16 October 2017
KYEC obtains key backend orders from MediaTek
Testing house King Yuan Electronics (KYEC) has obtained orders for MediaTek's major products for 2018, including 12nm mobile SoCs, and chips solutions for voice assistant devices...
Thursday 12 October 2017
Morris Chang sees hurdle for semiconductor development in China
While China is aggressively accelerating the development of its semiconductor industry, a hidden barrier will gradually surface to affect its development, in that many countries will...
Thursday 12 October 2017
Pure-play foundries boosting presence in China
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
Monday 2 October 2017
Staying focused on profitability: Q&A with UMC co-president SC Chien
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...
Tuesday 26 September 2017
Samsung ready to mass produce MRAM chips using 28nm FD-SOI process
Samsung Foundry will soon be ready to enter mass production of magnetoresistive random-access memory (MRAM) chips built using 28nm fully depleted silicon-on-insulator (FD-SOI) process...
Wednesday 20 September 2017
Leading-edge paves way for pure-play foundry growth, says IC Insights
In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Wednesday 13 September 2017
ASML EUV equipment production to almost double in 2018
ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
Wednesday 23 August 2017
China could enhance its position in post-Moore's Law era, says former TSMC COO
China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...
Monday 21 August 2017
Qualcomm to extend tie-up with TSMC, says executive
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
Tuesday 15 August 2017
SPIL to invest US$25 million in China
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Wednesday 9 August 2017
UMC, VIS July revenues down
Pure-play wafer foundries United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential decreases in July consolidated revenues of 2.4% and...
Wednesday 9 August 2017
SMIC expects up to 3% revenue growth in 3Q17
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post revenue growth of up to 3% sequentially in the third quarter of 2017, with gross margin...
Friday 28 July 2017
eMemory announces validation of on-chip security IP on UMC advanced nodes
Taiwan-based eMemory has verified its latest on-chip security IP on several of UMC's advanced nodes, according to the embedded NVM IP provider. The IP, based on unique IC biometrics,...
Thursday 27 July 2017
UMC planning 28HPC, 22ULP processes
United Microelectronics (UMC) is looking to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, which will become available in 2018. The foundry also plans...