Long-proposed plans for China-based wafer foundries Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corporation (GSMC) to jointly set up a 300mm (12-inch) fab has reportedly...
White-box netbook makers in China have recently started to manufacture netbooks with panels sized larger than 12-inches that adopt either an AMD or VIA processor platform, as market...
King Yuan Electronics Company (KYEC) on July 23 announced its board of directors has approved plans to raise its capex budget to NT$1.6 billion (US$48.68 million) for 2009, a 60%...
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Inotera Memories' board of directors has decided to issue GDRs equivalent to a total of up to 800 million stocks in order to raise around NT$10 billion (US$303.81 million). The funding...
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
Elpida Memory has been quietly developing a technology based on its existing 65nm equipment for DRAM production, to enable a die shrink to 50nm, industry sources have claimed. The...
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Taiwan-based DRAM makers should optimize capacity at their 12-inch fabs, which is the key to their survival in the global memory industry, according to Charles Kao, president of Inotera...
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according...
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Winbond Electronics has been transforming its product mix through phasing out standard DRAM and maintaining NOR flash and specialty DRAM as a focus, according to company president...
