IC packager Siliconware Precision Industries (SPIL) disclosed on April 16 that production subsidiary Siliconware Electronics (Fujian) has struck a deal with China MCC20 Group for...
China-based Fujian Jin Hua Integrated Circuit will complete equipment move-in as early as July, paving the way for volume production in the third quarter of 2018, according to industry...
Yangtze Memory Technologies (YMTC) under China's state-owned Tsinghua Unigroup has obtained its first orders for commercial production of over 10,000 3D NAND flash chips for use in...
Micron Technology is adding a new facility to its existing 12-inch wafer plant for the manufacture of NAND flash memory in Singapore. The new facility is expected to come online by...
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see its March revenues rebound to over NT$100 billion (US$3.43 billion), driven by a ramp-up of 16nm and 12nm chip...
Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...
Formosa Sumco Technology (FST), a Taiwan-based manufacturer of 8- and 12-inch semiconductor silicon wafers, saw its net profit hit a 10-year high of NT$2.24 billion (US$76.8 million)...
Rumors have claimed China's Big Fund is looking to invest in Taiwan-based Sino-American Silicon Products (SAS) in order to secure wafer supply, but sources close to the semiconductor...
Foundry chipmaker Powerchip Technology has reported net profits climbed 23% on year to NT$8.08 billion (US$276.8 million) in 2017, with EPS reaching NT$3.54. The year also marked...
Bolstered by China's large population, solid mobile network infrastructures, and aggressive deployments in IoT and AI applications, the localization of its semiconductor industry...
Silicon wafers will continue to experience tight supply in 2018, driven by robust demand from IC foundries. Taiwan-based GlobalWafers and Formosa Sumco Technology (FST) are both among...
Prices for upstream wafers will rise more than 30% in 2018, according to Miin Wu, chairman for Taiwan-based Macronix International, a supplier of flash memory and mask ROM chips.
Memory makers are demanding their downstream clients place orders for DRAM chips bundled with certain amounts of NAND flash, according to industry sources. Such bundled deals are...
