Taiwan's vendors of LCD driver ICs and MOSFET chips are mulling raising their quotes to reflect increased costs resulting from tight capacity at 8-inch or even 12-inch wafer fabs,...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...
Fingerprint ID chips vendor Egis Technology expects a surge in shipment pull-in from Chinese handset vendors in the third quarter of 2020, but whether this can generate a sequential...
Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...
Silicon wafer manufacturer GlobalWafers has reported net profits grew 18% sequentially to NT$3.4 billion (US$115.5 million) in the second quarter, with net profit margin hitting a...
TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.
Pure-play foundry United Microelectronics (UMC) expects 8-inch foundry quotes to be favorable to the company in 2021, judging from the already tight capacities at 8-inch foundries...
China's upcoming 14th five-year plan (2021-2025) will continue to highlight technology and capacity upgrades as the core of its semiconductor self-sufficiency strategy, with foundry...
Micron Technology remains optimistic about its operations in the fourth quarter of fiscal 2020, thanks to continued strong demand for data center applications, and the company's efforts...
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...
Winbond Electronics has been stepping up its deployment in the high-density NOR flash field, gearing up for a boom in demand for 5G related applications, according to company president...
TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...
Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...
With China-based 8- and 12-inch wafer fabs gearing up for equipment and facility upgrades, Taiwan-based fab tool provider Gudeng Precision Industrial is expected to be among the beneficiaries,...
