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    NEWS TAGGED 12-INCH
    Monday 20 October 2025
    Silan Microelectronics to build US$2.8B analog IC plant in Xiamen

    Silan Microelectronics has signed a strategic cooperation agreement with the Xiamen Municipal Government and Haicang District Government...

    Friday 17 October 2025
    GlobalWafers launches Fab300 in Italy, boosting Europe's semiconductor autonomy
    GlobalWafers announced on October 16 that its new 12-inch wafer fab, Fab300, in Novara, Italy, has officially begun operations. This marks a significant step in the company's global...
    Wednesday 8 October 2025
    China and Taiwan chart diverging paths in the 12-Inch SiC market
    In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...
    Tuesday 7 October 2025
    China's SiC industry finds high-value exit in Meta's AR supply chain

    As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

    Thursday 2 October 2025
    CoWoS creates turning point for 12-inch SiC
    Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
    Wednesday 1 October 2025
    China's 12-inch SiC leap: SICC, Jingsheng in spotlight
    The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
    Tuesday 30 September 2025
    GlobalFoundries opens Beijing office, doubles down on localizing production for China market
    US-based foundry GlobalFoundries (GF) has faced numerous challenges in its China strategy, from halting investment in a 12-inch fab in Chengdu to shifting toward mature process partnerships...
    Tuesday 30 September 2025
    Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain
    The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is set...
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    BIZ FOCUS
    Sep 29, 08:00
    Breaking free from keyword constraints: GeoGraph elevates job matching
    Thursday 24 September 2026
    FSP Debuts World's First 80 PLUS Ruby ATX PSU
    Wednesday 23 September 2026
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    reportAIglasses