NTT plans to establish an investment fund of more than JPY70 billion (approx. US$440 million), with major South Korean and Taiwanese partners to accelerate the international expansion of IOWN, its next-generation communications platform based on optical technology, Yomiuri reported.

Huawei Cloud is tying its next phase of cloud growth to Agentic AI, domestic computing power, and industry-specific deployment, launching a new infrastructure framework at its 2026 Huawei Cloud Inspire conference in Shanghai as it seeks a larger role in enterprise AI and smart driving.

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels.