Pegatron drives Scope 3 decarbonization through digital platforms, supplier engagement
1min ago in Sustainability
Taiwan digs deep: 2,049-meter geothermal well strikes 140°C in Taitung
3min ago in Sustainability
Samsung reportedly plans 2nm fab to boost HBM base-die output
3min ago in Semiconductors
SK Hynix leads HBM4 yield at 60%, expands DRAM supply
13min ago in Semiconductors
Arm reports record fiscal 2Q27 revenue on licensing momentum and AGI CPU demand
14min ago in Semiconductors
MUFG, SMBC to renew JPY600 billion credit lines for scandal-hit Nidec
19min ago in ICT
Inventec server demand drives record 10-month revenue
22min ago in ICT
Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers
23min ago in Semiconductors
Syntec Technology's new factories in India, Malaysia to push capacity to more than double in 2027
26min ago in ICT
QuantumDiamonds targets HBM defects as it develops inline inspection tool
33min ago in Semiconductors
CXMT prepayments surge 16x with DRAM shortage lifting market share
34min ago in Semiconductors
AI doubts mount, but server supply chain still sees strong demand
39min ago in ICT
Anthropic's Claude reportedly cuts custom chip design timelines with a 15-person team
44min ago in Semiconductors
Mitsui Chemicals reportedly plans US$8.2B acquisition of JSR in Japan chip materials push
45min ago in Semiconductors
GlobalFoundries secures nearly US$1 billion in custom chip design wins as it expands into physical AI
51min ago in Semiconductors
NAND giants target AI inference as South Korean SSD exports surge
Nov 4, 17:02 in Tomorrow's Headlines
Semiconductor equipment lead times stretch as TSMC, Micron and Intel discuss 2029 orders
Nov 4, 16:59 in Tomorrow's Headlines
Commentary: AOI secures long-term supply of InP substrates from China amid tight supply
Nov 4, 16:59 in Tomorrow's Headlines