中文網
Taipei
Mon, Aug 15, 2022
11:51
clear
34°C
CONNECT WITH US

IC packaging materials lifted by car, industrial needs

Julian Ho, Taipei; Ines Lin, DIGITIMES Asia 0

Credit: DIGITIMES

The growths of automotive and industrial applications have boosted demand for IC packaging materials such as leadframes, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories