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Wednesday 4 November 2026
Onsemi targets every stage of AI power delivery while holding back automotive restocking
Onsemi is pitching its AI data center business as a play on the entire power path inside an AI rack, and for now it is prioritizing that business and industrial customers over automotive restocking. On its third-quarter 2026 earnings call, the US chipmaker repeated that AI data center revenue should double in 2027 from a higher 2026 base. It also guided automotive revenue down by a high single-digit percentage in the fourth quarter, which management called a supply decision, not a strategic one.
Wednesday 4 November 2026
Bosch creates semiconductor division to expand in robotics, external chipmaking
Bosch plans to create a dedicated semiconductor division as it seeks more business in robotics, AI infrastructure, and manufacturing for external customers, extending a chip strategy rooted in automotive electronics into additional markets.
Monday 2 November 2026
AI data center demand fuels THEIL's optical communications rebound, 4Q26 to buck seasonal downtrend
Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor materials, and image sensors, during an earnings call on October 30.
Friday 30 October 2026
In-cabin sensing emerges as automakers' next value-added frontier
The in-cabin sensing market is entering a rapid expansion phase. Global Market Insights estimates that the market for in-cabin sensing, including biometric identification and driver monitoring systems (DMS), will grow from US$5.3 billion in 2025 to US$31.7 billion in 2035, representing a compound annual growth rate (CAGR) of 18.4%, with Asia-Pacific being the largest market, driven primarily by European Commission (EC) regulations and the European New Car Assessment Program (Euro NCAP) requirements.
Friday 30 October 2026
Dowoo Insys develops rollable OLED UTG for vehicles
South Korean ultra-thin glass (UTG) maker Dowoo Insys is expanding its smartphone glass technology into the automotive market, developing protective glass for rollable OLED displays with a major South Korean automotive electronics company. The product could enter commercial production as early as the second half of 2027.
Thursday 29 October 2026
Global Technology's first automotive chip headed for Hyundai, Kia
South Korean chip designer Global Technologies (GT) has secured a place in Hyundai Motor and Kia's supply chain with its first automotive semiconductor product, a smart LED module for interior ambient lighting developed with Hyundai Mobis. The product, called ID804, is scheduled to enter mass production in the second half of 2026.
Wednesday 28 October 2026
UMC utilization tops 90% in 2H26 as AI demand drives expansion
United Microelectronics (UMC) saw operating momentum strengthen in the third quarter of 2026, as demand for artificial intelligence (AI), high-performance computing (HPC), communications, and automotive chips continued to drive the mature and specialty process markets.
Wednesday 28 October 2026
NXP's automotive content gains, industrial demand strengthen its growth outlook
NXP Semiconductors' latest results point to a business gaining from more complex vehicle electronics and industrial computing, while its emerging data center operation offers another route to growth. The next test is whether those opportunities can sustain demand as the company adds manufacturing capacity and customers weigh their inventory needs.
Wednesday 28 October 2026
NXP lines up software-defined vehicles, industrial AI and data centers for double-digit growth in 2027
NXP Semiconductors is heading into 2027 with management arguing that its growth now rests on several structural drivers rather than a cyclical rebound. On the company's October 27 earnings call, executives said software-defined vehicles (SDV), AI at the industrial edge and data center control systems would sustain double-digit revenue growth next year.
Tuesday 27 October 2026
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory (HBM) and server products, automotive memory faces rising prices and tighter supplies, making automakers' direct procurement, long-term partnerships, and in-house chip design increasingly strategic.
Friday 23 October 2026
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform in 2026. The move targets demand for automotive electronics, robots, and edge AI chips while leveraging existing deep ultraviolet (DUV) production lines to control wafer costs.
Thursday 22 October 2026
Texas Instruments posts rising Q3 sales across data centers, cars, industry
Texas Instruments reported strong revenue growth in its third-quarter earnings call due to strong demand across its industrial, automotive, and data center businesses. The company said it is facing a tight supply environment for its chips, but brought up its ramping of production and testing capacity, including through its new Malaysia back-end facility.
Thursday 22 October 2026
BOS, LG, and HANA Micron team up on Korean automotive chiplets
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip design with packaging and vehicle testing. ChosunBiz and ZDNet Korea reported the collaboration on October 20.
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The fundraising follows the automaker's recent opening of its in-house technologies to external customers, mirroring similar moves by other Chinese EV companies.
Tuesday 20 October 2026
China's auto market contracts, Europe alone grows, Taiwan auto suppliers face risks
Global passenger vehicle registrations totaled approximately 46.77 million in the first eight months of 2026, down 6% year-over-year. The market is expected to contract 3.4% for the full year, as China's domestic market plunges, Europe remains the only growth market among China, Europe, and the US, and the war involving Iran drives up oil prices and freight costs, creating both risks and opportunities for Taiwan's automotive suppliers.
Wednesday 14 October 2026
LG, Bosch team up on automotive chiplets
LG Electronics is reportedly working with Bosch to develop automotive chiplets, a move that would mark LG's formal entry into the automotive semiconductor market if the technology reaches production and wins customers. The business could also create synergies with the LG Group's broad automotive electronics operations.
Wednesday 14 October 2026
Y.S. Tech reports liquid-cooling orders secured through early 2028
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance computing (HPC) cooling businesses. The company reported consolidated revenue of NT$306 million (US$9.6 million) in September 2026, bringing revenue for the first three quarters to NT$3.162 billion.
Tuesday 13 October 2026
SmartSens targets automotive CIS, robot vision growth with US$478M funding
Chinese CMOS image sensor (CIS) maker SmartSens completed a CNY3.2 billion (approx. US$478 million) capital increase in September 2026 to expand into automotive electronics and AI vision. The investment targets high-performance imaging, intelligent driving and on-device AI computing, extending its sensing technology into image processing and edge applications as demand for environmental perception grows in vehicles and robots.
Thursday 8 October 2026
Samsung to exit in-house automotive AP, focus on high-margin chips
Samsung Electronics' System LSI division is reportedly planning a retreat from the automotive application processor (AP) business and launching a major restructuring, with a future focus on high-margin areas such as image sensors and mobile system-on-chip (SoC) products. Analysts say Samsung is seeking to improve profitability in its non-memory businesses through a selection and concentration strategy after years of losses at System LSI and its foundry operations.
Thursday 8 October 2026
SAS first-three-quarter revenue hits record NT$61.38 billion as it expands manufacturing, services
Sino-American Silicon Products (SAS) is expanding its renewable energy business through a dual-track strategy focused on manufacturing and services, amid the explosive growth in demand for artificial intelligence (AI) computing power. Not only is this driving up power consumption at data centers and advanced manufacturing facilities, it is also fueling urgent demand from companies for green power, energy storage, and energy management services.
Tuesday 22 September 2026
Xpeng plans to license tech to more foreign automakers

Chinese EV maker Xpeng is planning to offer its technology to foreign automakers beyond Volkswagen, according to people familiar with the matter, as technology licensing emerges as a new revenue engine for the company.

Monday 21 September 2026
Shell oil shortage puts Volkswagen contract under review as Europe's aftermarket feels the strain

A Middle East war-driven oil squeeze is rippling beyond fuel stations and into Europe's auto repair network, with global implications for drivers, suppliers, and carmakers. Shell's engine oil shortage has prompted Volkswagen Group to review a contract worth millions of euros, reviving memories of the pandemic-era chip crisis.

Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated power systems. Its strategy for the next decade centers on improving power density: delivering more power in less space while managing heat, efficiency, and reliability.

Thursday 17 September 2026
DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion among SiC substrate makers. However, as SiC substrate capacity continued to surge, actual demand for SiC power devices from the EV sector fell short of expectations. This imbalance triggered a collapse in SiC substrate prices starting in 2024, extending the downward trend through 2026.
Tuesday 15 September 2026
XPeng's Turing chip expands beyond cars
XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical AI strategy. Originally designed for intelligent driving, the chip is now also used in XPeng's IRON humanoid robot. On September 8, the company launched its robot production line, with the first IRON completing automated final assembly.