There are reports of Samsung Electronics (Samsung) delaying the R&D of the automotive chip Exynos Auto and instead focusing on the development and mass-production of items including AI semiconductors and custom HBM, incorporating the "select and concentrate" strategy.
Rohm Semiconductor and United Automotive Electronic Systems (UAES), a major Tier-1 automotive supplier in China, have signed a long-term supply agreement for SiC power devices.
Among the major automotive chip and software giants - Qualcomm, NVIDIA, and Mobileye of Intel - the financial results for the second quarter of 2024 reveal a significant gap. Qualcomm's automotive business posted US$811 million, an 87% year-over-year increase, clearly outperforming NVIDIA's US$346 million, which saw a 37% increase, and Mobileye's US$439 million, down 3% year-over-year.
Rohm Semiconductor has announced the use of power modules equipped with the company's fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured by Zhejiang Geely Holding Group (Geely).
The highly anticipated Chinese AAA title, "Black Myth: Wukong," has finally been released. However, players quickly discovered that their hardware setup was the first challenge on their journey to the West.
Xpeng Inc. is looking for a manufacturing site in Europe, making it the latest Chinese electric vehicle maker seeking to mitigate the impact of import tariffs by building its cars in the region.
Taiwan's Acme Electronics is anticipating flat or slightly declining demand for its silicon carbide (SiC) powders used in electric vehicles (EVs) during the second half of 2024. To offset this impact, the company is actively exploring new applications for its products, according to company president Wen-hao Wu.
Despite the recent downturn in automotive chip demand, most Taiwan-based IC designers remain largely unaffected and continue to intensify their efforts in the market, according to industry sources.
Bloomberg previously reported that China's Ministry of Industry and Information Technology (MIIT) has instructed EV companies like BYD and Geely to increase the procurement of domestic electronic components and accelerate the adoption of locally produced semiconductor chips. Although there was an informal target for EV companies to increase the share of domestic chips to 20% by 2025, progress has been slow.
Chinese automakers are accelerating the localization of automotive chips to avoid being bottlenecked by chip supply chains and reduce reliance on foreign chips.
China's self-sufficiency push for ICs has limited the ability of multinational automotive IC integrated device manufacturers (IDM) and fabless chipmakers to secure orders from the Chinese market, which is experiencing a significant rise in electric vehicle (EV) sales.
The automotive chip market has been in the doldrums of late, with major European and American IDMs and Taiwanese IC design firms alike anticipating a gloomy forecast for the third quarter, and no signs of impending recovery.
Taiwan's display driver IC (DDI) vendor, FocalTech Systems, experienced mixed sales performances across its diverse product lines in the second quarter of the year. Despite this, the company remains optimistic about continued growth in AMOLED touchscreen ICs, driven by robust demand from the AI-enhanced smartphone segment.
Taiwanese display driver IC (DDI) leader Himax Technologies reported a robust second quarter, driven by strong demand for automotive DDI. However, the company is adopting a cautious outlook for the third quarter due to market uncertainties, projecting a 12-17% sequential revenue decline, against the traditional peak-season trend.
Intel recently introduced its first discrete graphics processing unit (dGPU), known as the Intel Arc graphics for automotive. The product is set to be commercially deployed in vehicles as early as 2025 to advance automotive AI.
Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's opening.
Black Sesame Technologies and Horizon Robotics, two China-based developers of smart driving chips, have recently filed for IPO on the Hong Kong Stock Exchange.
Rohm reported a declining performance over the past quarter due to sluggish sales of industrial chips and increased depreciation and research costs related to expanding production facilities for power semiconductors.
IC distributor WT Microelectronics (WT Micro) expects inventory adjustments for automotive and industrial ICs to persist through the end of this year, with more room for growth once completed.
Infineon Technologies has unveiled a new microcontroller unit (MCU) series for automotive system-on-chip (SoC) solutions, focusing on applications such as smart cockpits. This development comes through a collaboration with MediaTek, and Infineon is also working with other chip providers including Qualcomm, Intel, and Nvidia.
Infineon Technologies AG reported revenue that missed analysts' expectations after the hoped-for resurgence in the electric vehicle market was delayed.
Qualcomm has introduced an affordable smartphone SoC tailored for India, the world's second-largest smartphone market. This move comes as more Indian consumers opt for premium phones, while Qualcomm's main competitor targets the country's growing automotive chip sector.
Despite achieving results at the top end of its guidance, Qualcomm anticipates stable performance in the smartphone and automotive markets, even as it expands its market share in the high-end handset segment.
Financial data from leading European and American integrated device manufacturers (IDMs) indicate that the automotive semiconductor market is underperforming, with weaker demand than initially anticipated.
