中文網
Taipei
Fri, Aug 12, 2022
20:51
mostly clear
29°C
CONNECT WITH US

Intel to invest US$3.5 billion to boost advanced packaging technologies

Jessie Shen, DIGITIMES, Taipei 0

Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros 3D packaging technology.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories