Innodisk is targeting the growing edge AI market through a joint development with Qualcomm, introducing an 'AI on Dragonwing' computing solution. Its first product, the EXMP-Q911 COM-HPC Mini module, delivers up to 100 TOPS of AI performance, pairs low power consumption with a –40°C to 85°C (–40°F to 185°F) operating range, and is designed for harsh edge environments.
Innodisk said Qualcomm's Dragonwing system-on-chip (SoC) platform will be supported by a supply commitment through 2038, ensuring long-term availability and deployment stability.
According to Innodisk, AI on Dragonwing is the first product line under its "AI on Arm" portfolio. The company plans to work with global partners to continue developing Arm-based computing solutions and broaden edge AI applications.
The AI on Arm launch marks a key milestone for Innodisk and Qualcomm, highlighting joint development results from early system design to hardware-software integration.
The first core product from the partnership is the EXMP-Q911 COM-HPC Mini module, powered by the Qualcomm Dragonwing IQ-9075 processor, delivering up to 10× higher AI inference performance than comparable modules.
The EXMP-Q911 integrates 36GB of LPDDR5X memory and 128GB of UFS 3.1 storage, with high-speed interfaces including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP1.2, MIPI CSI-2, and CAN FD, enabling flexible expansion in compact edge systems.
Innodisk said it will deepen cooperation with Qualcomm across reference designs, demo kits, and market promotion. The company plans to expand its lineup to cover Dragonwing IQX and IQ8 SoCs and additional Arm platforms, supporting scaled edge AI deployment in industrial automation, AGV/AMR systems, and smart city applications.
Article edited by Jack Wu
