Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio.
The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance. This is important because these chips are used in a range of areas essential to everyday life, including AI accelerators, automotive systems, and next-generation 6G communications networks, which are set for global rollout over the next few years.
The DaVinci Gen V solves the fundamental industry challenges of impedance tuning – an essential part of circuit design that enables the maximum transfer of signal power – and signal integrity – the measurement of the quality of an electrical signal as it travels through a circuit. By tackling these challenges the DaVinci Gen V ensures reliable, super-high performance in electronic systems and testing.
Brian Mitchell, Vice President of Smiths Interconnect's Semiconductor Test Business Unit, said: "This innovation empowers semiconductor manufacturers to test faster, more reliably, and with greater precision – ensuring their products meet the demands of AI, 6G, and next-generation technologies. More than just a product, DaVinci Gen V embodies Smiths Interconnect's commitment to advancing semiconductor testing through continuous innovation."
The technical specification
The product delivers breakthrough high-speed signal transmission performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications – these speeds are crucial for supporting the growing demand for massive data transfer.
The product also supports the growing complexity of modern integrated circuits, accommodating a 40% increase in next-generation ASIC (application-specific integrated circuits) sizes. ASICs are powerful computer chips that combine several different circuits all on one chip, in a 'system on a chip' design.
As next-generation integrated circuits continue to evolve – doubling in bandwidth and computational power every two years – DaVinci Gen V is designed for seamless integration. It maintains full compatibility with existing test hardware, allowing manufacturers to transition effortlessly, reduce development cycles, and accelerate time-to-market.
Brian Mitchell, Vice President of Smiths Interconnect's Semiconductor Test Business Unit.Credit: Smiths Interconnect
Article edited by Jack Wu
