Raytheon collaborates with AMD to build next-gen multi-chip package

Jessie Shen, DIGITIMES Asia, Taipei 0

Credit: AMD

Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation multi-chip package for use in ground, maritime, and airborne sensors, according to the major US defense contractor.

Under the contract, Raytheon will package state-of-the-art commercial devices from industry partners like AMD to create a compact microelectronics package that will convert radio frequency energy to digital information with more bandwidth and higher data rates. The integration will result in new system capabilities designed with higher performance, lower power consumption, and reduced weight.

This multi-chip package will be built utilizing the most recent industry-standard die-level interconnect technology, allowing individual chiplets to achieve peak performance and new system capabilities in a cost-effective and high-performance manner. It is designed to meet Raytheon's scalable sensor processing requirements.

"By teaming with commercial industry, we can incorporate cutting-edge technology into Department of Defense applications on a much faster timescale," said Colin Whelan, president of advanced technology at Raytheon. "Together, we will deliver the first multi-chip package that features the latest in interconnect ability - which will provide new system capabilities to our warfighters."

Raytheon indicated that the chiplets from commercial partners will be integrated into a Raytheon-designed and fabricated interposer by its 3D universal packaging (3DUP) domestic silicon manufacturing process in Lompoc, California.