Intel and United Microelectronics (UMC) have announced a collaboration on the development of a 12-nanometer semiconductor process platform for high-growth markets such as mobile, communication infrastructure, and networking.
The long-term deal combines Intel's at-scale US manufacturing capabilities with UMC's foundry experience on mature nodes, resulting in an expanded process portfolio, according to the companies. It also provides global customers with more sourcing options by connecting them to a more regionally diverse and resilient supply chain.
The collaboration builds on Intel's commitment to partnering with innovative companies in Taiwan to help the company better serve global customers and expand its mature process capabilities for foundry customers. It also provides UMC with additional production capacity, accelerates its development roadmap, and demonstrates its leading process technology R&D, the companies said in a joint statement.
Joint manufacturing on 12nm
The 12nm node will leverage Intel's US-based high-volume production capabilities and FinFET transistor design experience, resulting in a potent combination of maturity, performance, and power efficiency. UMC's decades of process leadership and experience providing PDKs and design support would greatly enhance production and foundry services.
Intel's Ocotillo Technology Fabrication site in Arizona will develop and build the new process node in Fabs 12, 22, and 32. Leveraging existing equipment in these fabs will greatly minimize upfront investment requirements and optimize utilization.
The two companies will collaborate to meet customer demand and support the 12nm technology through electronic design automation and intellectual property solutions from ecosystem partners. Production of the 12nm process is scheduled to commence in 2027.
"Intel's strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world's second-largest foundry by 2030," said Stuart Pann, Intel SVP and GM of Intel Foundry Services (IFS).
"Our collaboration with Intel on a U.S.-manufactured 12 nm process with FinFET capabilities is a step forward in advancing our strategy of pursuing cost-efficient capacity expansion and technology node advancement in continuing our commitment to customers," noted UMC co-president Jason Wang. "This effort will enable our customers to smoothly migrate to this critical new node, and also benefit from the resiliency of an added Western footprint."
