Micron intros 128GB RDIMMs using monolithic 32Gb DRAM

Jessie Shen, DIGITIMES Asia, Taipei 0

Credit: Micron Technology

Micron Technology has announced a 32GB monolithic die-based 128GB DDR5 RDIMM memory with up to 8000 MT/s speed to satisfy today's and future data center applications. These high-capacity, high-speed memory modules are intended to meet the performance and data-handling requirements of mission-critical applications in data center and cloud environments, including artificial intelligence (AI), in-memory databases (IMDB), and efficient processing for multithreaded, multicore count general compute workloads.

The 32Gb DDR5 DRAM die-based 128GB DDR5 RDIMM memory, powered by Micron's 1-beta process technology, outperforms rival 3DS through-silicon via (TSV) products as follows: More than 45% higher bit density; up to 24% higher energy efficiency; 16% lower latency; up to 28% higher AI training performance, and up to a 28% improvement in AI training performance.

Micron's 32Gb DDR5 memory solution employs innovative die architecture choices to achieve industry-leading array efficiency and the densest monolithic DRAM die. Voltage domain and refresh management functions aid in optimizing the power delivery network, resulting in much-needed energy efficiency gains. Furthermore, the die-dimension aspect ratio of the 32Gb high-capacity DRAM die was tuned to improve production efficiency.

Micron also noted that its 1β process technology node has reached yield maturity in the shortest time in the company's history by employing AI-powered smart manufacturing methods.

Micron's 128GB RDIMMs will be available in platforms capable of 4800MT/s, 5600MT/s, and 6400MT/s in 2024, with future platforms capable of up to 8000MT/s planned.

"Our latest 4th Gen AMD EPYC processors will benefit from optimized memory capacity per core with Micron's 128GB RDIMMs, which use 32Gb monolithic DRAM to provide an improved total cost of ownership solution for business-critical data enterprise workloads, such as AI, high-performance computing and virtualization," said Dan McNamara, SVP and GM of AMD's server business unit, in Micron's statement. "As AMD advances compute with our next-gen EPYC processors, Micron's 128GB RDIMMs will likely become one of the main memory options to deliver high-capacity and bandwidth per core capabilities to address the demands of memory-intensive applications."

"We look forward to Micron's 32Gb-based 128GB RDIMM for the bandwidth and performance-per-watt solution benefits available in the server and AI systems market. Intel is evaluating this 32Gb memory offering for key DDR5 server platforms based on the resulting total cost of ownership benefits to cloud, AI, and enterprise customers," said Dimitrios Ziakas, VP of Intel's memory and IO technologies, in the same statement.