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After recruiting TSMC veteran, Samsung is rumored to enter FOWLP mass production in 4Q23

Amy Fan, Taipei; Jack Wu, DIGITIMES Asia Tuesday 11 April 2023 0

Credit: Samsung Semiconductor

Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter of 2023.

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